ATS-18F-151-C1-R0
AI

The **ATS-18F-151-C1-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic integrated circuits (ICs) to prevent overheating.
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### 1. Technical Specifications
The following table outlines the physical and thermal characteristics of this part:
| Parameter | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) |
| **Series** | pushPIN™ |
| **Attachment Method** | Push-Pin (Spring-loaded) |
| **Material** | Aluminum (AL6063) |
| **Finish** | Blue Anodized |
| **Dimensions (L x W)** | 35.00mm x 35.00mm |
| **Height** | 10.00mm |
| **Pin Pitch** | 40.00mm (Center to Center) |
| **Thermal Resistance** | 9.37 °C/W (@ 100 LFM) |
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### 2. Key Features and Components
* **pushPIN™ Attachment:** This model uses a push-pin and brass spring mechanism. This provides a secure, consistent pressure on the electronic chip, which optimizes the thermal interface material (TIM) performance.
* **XC (Cross-Cut) Fin Design:** The "151" in the part number indicates a specific fin pattern. Cross-cut fins allow for multi-directional airflow, making the heat sink effective even if the airflow in the chassis is turbulent or changes direction.
* **Pre-Applied Thermal Interface Material:** This specific model usually comes with **T766** thermal tape or grease pre-applied to the base, ensuring an efficient thermal path from the component to the aluminum.
* **Low Profile:** With a height of only 10mm, it is designed for "1U" or low-clearance applications like network switches, blade servers, or compact embedded systems.
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### 3. Thermal Performance (Airflow Data)
Thermal resistance varies based on the velocity of the air passing through the fins (measured in Linear Feet per Minute - LFM):
| Air Velocity (LFM) | Thermal Resistance (°C/W) |
| :--- | :--- |
| 100 (0.5 m/s) | 9.37 |
| 300 (1.5 m/s) | 4.45 |
| 500 (2.5 m/s) | 3.32 |
| 700 (3.5 m/s) | 2.80 |
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### 4. Part Number Breakdown
The suffix **-C1-R0** provides specific details:
* **C1:** Indicates the material and color (Blue Anodized Aluminum).
* **R0:** Refers to the revision and packaging standards (RoHS compliant).
- ⤷What is the difference between push-pin and adhesive mounting for heat sinks?
- ⤷ How do I calculate the required thermal resistance for my electronic component?
- ⤷ Can this heat sink be used for a Raspberry Pi or similar SoC?