Electronic Components Datasheet Search
  English  ▼
ALLDATASHEET.NET

X  

  • ATS-18F-164-C2-R0

  • AI
    The **ATS-18F-164-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, designed to provide low thermal resistance and high airflow efficiency. --- ## 1. Technical Specifications The following table outlines the physical and thermal characteristics of this specific part: | Characteristic | Specification | | :--- | :--- | | **Material** | Aluminum (Blue Anodized) | | **Dimensions** | 45mm x 45mm x 33mm | | **Thermal Resistance** | 2.41°C/W @ 200 LFM (Linear Feet per Minute) | | **Attachment Method** | pushPIN™ (Spring-loaded attachment) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | | **Fin Style** | straight-fin | --- ## 2. Key Components & Features ### A. Material and Coating * **Aluminum Body:** Provides a lightweight solution with high thermal conductivity. * **Blue Anodized Finish:** Not only improves the aesthetic but also enhances surface emissivity and provides corrosion resistance. ### B. The pushPIN™ Attachment System This part uses a specific mounting mechanism designed for secure and easy assembly: * **Spring-loaded Pins:** These ensure uniform pressure across the component, optimizing the thermal contact between the heat sink and the chip. * **Reliability:** It is designed to withstand vibration and mechanical stress better than adhesive tapes. ### C. Thermal Interface Material (TIM) * The **T766** material is pre-applied to the base. Its role is to fill the microscopic air gaps between the CPU/GPU surface and the heat sink base, ensuring maximum heat transfer. --- ## 3. Application Use Cases The ATS-18F-164-C2-R0 is typically used in environments where high-density components generate significant heat: 1. **Telecommunications:** Cooling for high-speed processors in switches and routers. 2. **Embedded Computing:** High-performance ARM or X86 single-board computers. 3. **Power Supplies:** Heat dissipation for MOSFETs or IGPTs in high-density power bricks. --- ## 4. Part Number Breakdown (Nomenclature) Understanding the code helps in identifying variations: * **ATS:** Advanced Thermal Solutions (Manufacturer). * **18F:** Series designation (maxiFLOW™ family). * **164:** Specific geometry and fin configuration. * **C2:** Material/Finish code (Blue Anodized). * **R0:** Revision or packaging code.
    ✨ Follow-up Questions
    • ⤷ What are the specific hole patterns required on the PCB for the pushPIN mounting?
    • ⤷ How does the thermal resistance change at different airflow speeds (LFM)?
    • ⤷ Are there alternative TIM options for this heat sink if T766 is not suitable for my application?