ATS-18F-164-C2-R0
AI

The **ATS-18F-164-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, designed to provide low thermal resistance and high airflow efficiency.
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## 1. Technical Specifications
The following table outlines the physical and thermal characteristics of this specific part:
| Characteristic | Specification |
| :--- | :--- |
| **Material** | Aluminum (Blue Anodized) |
| **Dimensions** | 45mm x 45mm x 33mm |
| **Thermal Resistance** | 2.41°C/W @ 200 LFM (Linear Feet per Minute) |
| **Attachment Method** | pushPIN™ (Spring-loaded attachment) |
| **Thermal Interface Material (TIM)** | T766 (Pre-applied) |
| **Fin Style** | straight-fin |
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## 2. Key Components & Features
### A. Material and Coating
* **Aluminum Body:** Provides a lightweight solution with high thermal conductivity.
* **Blue Anodized Finish:** Not only improves the aesthetic but also enhances surface emissivity and provides corrosion resistance.
### B. The pushPIN™ Attachment System
This part uses a specific mounting mechanism designed for secure and easy assembly:
* **Spring-loaded Pins:** These ensure uniform pressure across the component, optimizing the thermal contact between the heat sink and the chip.
* **Reliability:** It is designed to withstand vibration and mechanical stress better than adhesive tapes.
### C. Thermal Interface Material (TIM)
* The **T766** material is pre-applied to the base. Its role is to fill the microscopic air gaps between the CPU/GPU surface and the heat sink base, ensuring maximum heat transfer.
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## 3. Application Use Cases
The ATS-18F-164-C2-R0 is typically used in environments where high-density components generate significant heat:
1. **Telecommunications:** Cooling for high-speed processors in switches and routers.
2. **Embedded Computing:** High-performance ARM or X86 single-board computers.
3. **Power Supplies:** Heat dissipation for MOSFETs or IGPTs in high-density power bricks.
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## 4. Part Number Breakdown (Nomenclature)
Understanding the code helps in identifying variations:
* **ATS:** Advanced Thermal Solutions (Manufacturer).
* **18F:** Series designation (maxiFLOW™ family).
* **164:** Specific geometry and fin configuration.
* **C2:** Material/Finish code (Blue Anodized).
* **R0:** Revision or packaging code.
- ⤷
What are the specific hole patterns required on the PCB for the pushPIN mounting?
- ⤷ How does the thermal resistance change at different airflow speeds (LFM)?
- ⤷ Are there alternative TIM options for this heat sink if T766 is not suitable for my application?