The **ATS-18F-166-C1-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of their "push-pin" series designed for secure mounting on Printed Circuit Boards (PCBs). --- ### 1. Technical Specifications The following table outlines the physical and thermal properties of this specific part number: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum (Blue Anodized) | | **Dimensions** | 25mm x 25mm x 15mm | | **Fin Style** | Straight Fin (Maximized Surface Area) | | **Attachment Method** | Push-Pin (Plastic) | | **Thermal Resistance** | 12.12°C/W (at 1.0 m/s airflow) | | **Thermal Interface** | T766 (High Performance Phase Change) | --- ### 2. Breakdown of the Part Number The nomenclature for ATS products follows a specific coding logic: * **ATS**: Manufacturer (Advanced Thermal Solutions). * **18F**: Indicates the specific product family/series. * **166**: Refers to the physical footprint and internal design code. * **C1**: Denotes the material and finish (usually Blue Anodized Aluminum). * **R0**: Indicates the revision number and packaging status. --- ### 3. Key Electronic Components This part is categorized as a **Passive Cooling Device**. Its primary function is to dissipate heat generated by active electronic components. #### A. The Heat Sink Body The base is 25mm square, making it ideal for small ICs (Integrated Circuits), ASICs, or FPGAs. The **Straight Fin** design is optimized for environments where there is a consistent directional airflow (forced convection). #### B. Attachment Mechanism (Push-Pins) Unlike adhesive-based heat sinks, this model uses a **brass or plastic push-pin with a compression spring**. * **Benefits:** Provides consistent downward pressure (load) on the chip, improving thermal transfer. * **Reliability:** It is more vibration-resistant than thermal tape. #### C. Thermal Interface Material (TIM) The "C1" variant usually comes pre-applied with **T766**. This is a phase-change material that softens when the component reaches operating temperature, filling microscopic air gaps between the chip and the heat sink for maximum efficiency. --- ### 4. Application Use Cases This heat sink is typically found in: * **Network Switches/Routers:** Cooling small processors. * **Embedded Systems:** For industrial computing modules. * **Power Supplies:** Cooling voltage regulators.