The **ATS-18F-170-C2-R0** is a high-performance electronic thermal management component, specifically a **heat sink** designed for cooling integrated circuits (ICs) and other electronic components. It is manufactured by Advanced Thermal Solutions (ATS) as part of their "push pin" attachment series. --- ### ## Technical Specifications Below are the primary physical and thermal characteristics of this component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push Pin (Plastic) | | **Spring Type** | Compression Spring | | **Dimensions (L x W x H)** | 25mm x 25mm x 15mm | | **Fin Style** | XCUT (Cross-Cut) | | **Thermal Resistance** | ~10.07° C/W (at 200 LFM) | --- ### ### Key Electronic & Mechanical Features #### 1. XCUT Fin Pattern The "XCUT" geometry means the fins are cut in both directions. This is critical for electronics where airflow direction may be unpredictable or inconsistent. Unlike straight-fin heat sinks, the cross-cut design allows air to enter from any angle, increasing the effective surface area and turbulence for better heat dissipation. #### 2. Push Pin Attachment This part uses a specific mechanical mounting system: * **Plastic Push Pins:** These snap into pre-drilled holes on the Printed Circuit Board (PCB). * **Compression Springs:** The springs provide a precise amount of downward pressure (load), ensuring the heat sink maintains firm contact with the electronic component without damaging it. #### 3. Material Efficiency Made from **Aluminum 6063**, it offers a high strength-to-weight ratio and excellent thermal conductivity. The **Blue Anodized** finish is not just for aesthetics; it provides surface protection against corrosion and increases the emissivity of the surface, slightly improving radiant cooling. --- ### ### Typical Applications In a circuit design, this part is typically used for: * **Processors (CPUs/GPUs):** Small-form-factor embedded processors. * **FPGAs:** Field Programmable Gate Arrays that generate significant heat in compact spaces. * **Power Supplies:** Cooling transistors or voltage regulators. * **Telecommunications:** Network switches and routers. ---