The **ATS-18F-180-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions, Inc. (ATS)**. It is part of their "pushPIN™" component cooling line, designed specifically for thermal management in electronics. --- ## Technical Specifications | Feature | Specification | | :--- | :--- | | **Product Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Type** | Push-Pin (Brass) | | **Dimensions (L x W x H)** | 35mm x 35mm x 35mm | | **Thermal Resistance** | 3.32°C/W (at 100 LFM) | | **Fin Pattern** | Fine Pitch (straight fins) | | **Thermal Interface Material** | T766 (Pre-applied) | --- ## Key Components and Features ### 1. The Heat Sink Body The body is constructed from **Aluminum**, which offers a balance between thermal conductivity and weight. The "180" in the part number indicates its specific fin profile and height (35mm), which provides a large surface area for heat dissipation in vertical spaces. ### 2. pushPIN™ Attachment Mechanism Unlike adhesive-based heat sinks, this uses a spring-loaded push-pin system. - **Benefits:** Provides consistent pressure to the processor or component, ensuring maximum contact with the Thermal Interface Material (TIM). - **Durability:** Allows for easy removal and re-installation without damaging the PCB. ### 3. Thermal Interface Material (TIM) The unit comes pre-applied with **T766**, a high-performance thermal grease. This fills the microscopic air gaps between the component (like a CPU, FPGA, or GPU) and the heat sink base to maximize heat transfer efficiency. ### 4. Blue Anodized Finish The blue coating is not just for aesthetics; **Anodization** increases corrosion resistance, provides electrical insulation (surface-level), and slightly improves thermal emissivity. --- ## Performance Data (Thermal Resistance) Thermal resistance measures the component's ability to dissipate heat. Lower values indicate better cooling. | Air Velocity (LFM) | 100 (0.5 m/s) | 300 (1.5 m/s) | 500 (2.5 m/s) | | :--- | :--- | :--- | :--- | | **Unducted Flow (°C/W)** | 3.32 | 1.61 | 1.20 | --- ### Typical Applications * **Networking Equipment:** Routers, switches, and base stations. * **Embedded Systems:** High-heat industrial controllers. * **Power Electronics:** Transistors and MOSFET arrays that require secure, mechanical mounting.