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  • ATS-18F-188-C2-R0

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    The **ATS-18F-188-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push pin" series designed to provide efficient cooling for electronic components like CPUs, GPUs, and other integrated circuits. --- ### 1. Technical Specifications The following table outlines the physical and thermal properties of the part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Brass) | | **Dimension (L x W)** | 45mm x 45mm | | **Height** | 15mm | | **Thermal Resistance** | 6.67°C/W @ 100 LFM (Airflow) | | **Fin Style** | Fine Pitch (Straight Fin) | --- ### 2. Key Features and Components #### A. Material and Coating * **Aluminum Construction:** Offers a high strength-to-weight ratio and excellent thermal conductivity. * **Blue Anodized Finish:** Not only provides a professional aesthetic but also adds a layer of corrosion resistance and slightly improves radiative heat transfer. #### B. Attachment Mechanism * **Push-Pins:** This model uses brass push-pins with a compression spring. This ensures a consistent and secure pressure against the electronic component, which is critical for maintaining an effective thermal interface. * **Spring Force:** Pre-assembled springs ensure the correct amount of force is applied to the PCB without damaging delicate components. #### C. Thermal Performance * The **Fine Pitch** design maximizes the surface area within a small footprint (45mm x 45mm). * It is designed for "forced air" environments (where a fan is present). The thermal resistance drops significantly as the air velocity (LFM) increases. --- ### 3. Application Use Cases This heat sink is typically found in: 1. **Telecommunications:** Cooling signal processors and routers. 2. **Embedded Systems:** Industrial PCs and automation controllers. 3. **Consumer Electronics:** High-end power supplies or logic boards where passive cooling is insufficient. ---
    ✨ Follow-up Questions
    • ⤷ What are the specific hole patterns required on a PCB for the ATS-18F-188-C2-R0 push-pins?
    • ⤷ How does the thermal resistance of this heat sink change at higher airflow rates like 500 LFM?
    • ⤷ What type of thermal interface material (TIM) is recommended for use with this aluminum heat sink?