ATS-18F-188-C2-R0
AI

The **ATS-18F-188-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push pin" series designed to provide efficient cooling for electronic components like CPUs, GPUs, and other integrated circuits.
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### 1. Technical Specifications
The following table outlines the physical and thermal properties of the part:
| Parameter | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | Push-Pin (Brass) |
| **Dimension (L x W)** | 45mm x 45mm |
| **Height** | 15mm |
| **Thermal Resistance** | 6.67°C/W @ 100 LFM (Airflow) |
| **Fin Style** | Fine Pitch (Straight Fin) |
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### 2. Key Features and Components
#### A. Material and Coating
* **Aluminum Construction:** Offers a high strength-to-weight ratio and excellent thermal conductivity.
* **Blue Anodized Finish:** Not only provides a professional aesthetic but also adds a layer of corrosion resistance and slightly improves radiative heat transfer.
#### B. Attachment Mechanism
* **Push-Pins:** This model uses brass push-pins with a compression spring. This ensures a consistent and secure pressure against the electronic component, which is critical for maintaining an effective thermal interface.
* **Spring Force:** Pre-assembled springs ensure the correct amount of force is applied to the PCB without damaging delicate components.
#### C. Thermal Performance
* The **Fine Pitch** design maximizes the surface area within a small footprint (45mm x 45mm).
* It is designed for "forced air" environments (where a fan is present). The thermal resistance drops significantly as the air velocity (LFM) increases.
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### 3. Application Use Cases
This heat sink is typically found in:
1. **Telecommunications:** Cooling signal processors and routers.
2. **Embedded Systems:** Industrial PCs and automation controllers.
3. **Consumer Electronics:** High-end power supplies or logic boards where passive cooling is insufficient.
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- ⤷
What are the specific hole patterns required on a PCB for the ATS-18F-188-C2-R0 push-pins?
- ⤷ How does the thermal resistance of this heat sink change at higher airflow rates like 500 LFM?
- ⤷ What type of thermal interface material (TIM) is recommended for use with this aluminum heat sink?