## Technical Specifications for ATS-18F-196-C3-R0 The **ATS-18F-196-C3-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the **pushPIN™** series, designed for cooling electronic components such as processors, chipsets, or power modules. ### 1. Key Physical Characteristics This component is characterized by its "straight fin" design and specific attachment mechanism. | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Dimensions** | 45mm x 45mm | | **Height** | 10mm | | **Mounting Type** | Push-Pin (Plastic) | | **Spring Type** | Brass | | **Thermal Interface Material (TIM)** | T412 (Phase Change Material) | --- ### 2. Thermal Performance Data Thermal resistance indicates how effectively the heat sink transfers heat away from the component. This varies based on the airflow (Velocity). | Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 100 | 0.5 | 18.26 (Unducted) | | 300 | 1.5 | 9.56 (Unducted) | | 500 | 2.5 | 7.41 (Unducted) | | 700 | 3.5 | 6.45 (Unducted) | --- ### 3. Component Design Details #### A. The pushPIN™ System The "R0" at the end of the part number signifies the attachment style. It uses a flexible, tool-less push-pin mechanism. * **Ease of Assembly:** Allows for quick installation on a PCB without needing screws or specialized tools. * **Compression:** The brass spring ensures constant pressure between the heat sink and the electronic component for optimal heat transfer. #### B. The Fin Pattern The **Straight Fin** design is optimized for environments with consistent airflow directions. * **Pitch:** The spacing between fins is calculated to minimize air pressure drop while maximizing surface area. * **Low Profile:** At only 10mm high, it is suitable for thin servers, laptops, or space-constrained embedded systems. #### C. Thermal Interface Material (TIM) The part comes pre-applied with **T412**. * This is a high-performance thermal pad that fills microscopic air gaps between the heat sink and the chip. * It is "Phase Change" material, meaning it softens slightly when heated to ensure perfect contact. --- ### 4. Summary of Use Cases * **Networking:** Switches and routers where horizontal airflow is common. * **Power Supplies:** Cooling MOSFETs or Voltage Regulators. * **Embedded Systems:** Industrial PCs with height restrictions.