The **ATS-18F-198-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ HS Assembly | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | 9.06 °C/W (Unducted Flow @ 100 LFM) | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W x H)** | 45mm x 45mm x 25mm | | **Fin Type** | Cross-Cut | --- ### 2. Design Characteristics #### A. Fin Design (Cross-Cut) Unlike straight-fin heat sinks, the **Cross-Cut** pattern creates a matrix of small pins/fins. This design is highly efficient because: * It increases the surface area for heat dissipation. * It allows for **omni-directional airflow**, meaning air can enter from any side of the heat sink, making it versatile for complex PCB layouts. #### B. Attachment Mechanism: pushPIN™ The "C2" in the part number refers to the attachment kit. The pushPIN™ system includes: * **Compression Springs:** Provides precise pressure (Force) to ensure optimal contact with the component (Thermal Interface Material efficiency). * **Brass/Plastic Push Pins:** Securely locks the heat sink into pre-drilled holes on the PCB. #### C. Thermal Interface Material (TIM) This specific model typically comes with **T766** pre-applied. T766 is a high-performance thermal phase-change material that fills the microscopic air gaps between the heat sink base and the electronic chip. --- ### 3. Application & Use Cases This heat sink is categorized as a "High-Performance" cooling solution, typically found in: 1. **Telecommunications:** Networking switches and routers. 2. **Industrial PCs:** Compact computers requiring passive or active forced-air cooling. 3. **Power Supplies:** Cooling MOSFETs or voltage regulators. --- ### 4. Thermal Performance Comparison The performance of the ATS-18F-198-C2-R0 varies significantly based on the Air Velocity (Measured in Linear Feet per Minute - LFM): | Air Velocity | 100 LFM (0.5 m/s) | 400 LFM (2.0 m/s) | 700 LFM (3.5 m/s) | | :--- | :--- | :--- | :--- | | **Thermal Resistance** | 9.06 °C/W | 4.42 °C/W | 3.53 °C/W |