The **ATS-18F-204-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **pushPIN™** series, designed for secure and efficient cooling of integrated circuits (ICs) and other electronic components. --- ### 1. Technical Specifications The following table highlights the core physical and thermal properties of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions** | 54.00mm x 54.00mm | | **Height (Fin)** | 12.00mm | | **Pitch** | Fine Pitch | | **Thermal Resistance** | 7.43 °C/W (at 100 LFM) | | **Thermal Interface Material** | T766 (Pre-applied) | --- ### 2. Design Characteristics The part is engineered for specific airflow conditions and mechanical reliability: * **Fin Configuration:** It uses a **Cross-Cut** design. This allows airflow from multiple directions, making it more versatile than straight-fin designs in congested PCB layouts. * **Attachment Mechanism:** The `pushPIN™` system consists of a brass or plastic pin and a compression spring. This ensures a consistent pressure (load) on the electronic component, which optimizes heat transfer through the Thermal Interface Material (TIM). * **Thermal Performance:** The performance varies significantly based on airflow (measured in Linear Feet per Minute - LFM): * **Low Airflow (1.0 m/s):** ~7.43 °C/W * **High Airflow (3.5 m/s):** ~2.31 °C/W --- ### 3. Part Number Breakdown The nomenclature follows a specific logic: | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer (Advanced Thermal Solutions) | | **18** | Series Identifier | | **F** | Fin Style (Fine Pitch) | | **204** | Specific Model/Size Reference | | **C2** | Color/Finish (Blue Anodized) | | **R0** | RoHS Compliant / Revision State | --- ### 4. Typical Applications This heat sink is commonly found in: * **Networking Hardware:** Switches and routers. * **Power Supplies:** High-efficiency DC-DC converters. * **Embedded Systems:** Industrial PCs and FPGA cooling. * **Consumer Electronics:** High-speed processors requiring a low-profile (12mm) solution.