## Technical Overview: ATS-18F-26-C2-R0 The **ATS-18F-26-C2-R0** is a high-performance **Heat Sink** assembly designed by Advanced Thermal Solutions (ATS). It belongs to the **blueICE™** series and is primarily used for cooling electronic components such as BGA (Ball Grid Array) packages, CPUs, or GPUs. --- ### 1. Key Technical Specifications | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-18F-26-C2-R0 | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Thermal Resistance** | 14.20°C/W @ Unducted Flow | | **Dimensions (L x W x H)** | 40mm x 40mm x 10mm | | **Fin Style** | Straight / Fine Pitch | --- ### 2. Component Analysis #### A. Thermal Management Design This part is designed to dissipate heat from surface-mount components. With a height of only **10mm**, it is considered a low-profile solution, making it ideal for compact server racks or thin electronic enclosures where vertical space is limited. #### B. The "Push-Pin" Mounting System The "18F" and suffix codes indicate the specific mounting hardware: * **Ease of Assembly:** Uses pre-drilled holes in the PCB and spring-loaded push-pins. * **Constant Pressure:** The spring ensures uniform pressure across the component interface, which optimizes the performance of the Thermal Interface Material (TIM). #### C. Material and Coating * **AL6063:** This aluminum alloy offers excellent thermal conductivity and structural integrity. * **Blue Anodizing:** Beyond aesthetics, the anodized layer provides increased corrosion resistance and slightly improves emissivity for radiant cooling. --- ### 3. Thermal Performance Data Performance varies based on the airflow velocity (measured in Linear Feet per Minute - LFM): | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 (1.0 m/s) | 6.95 | | 400 (2.0 m/s) | 4.60 | | 600 (3.0 m/s) | 3.75 | | 800 (4.0 m/s) | 3.20 | --- ### 4. Applications * **Telecommunications:** Cooling of networking switches and routers. * **Computing:** Secondary cooling for chipsets or high-speed memory controllers. * **Industrial:** Power supplies and embedded motor controllers. ---