## Technical Overview: ATS-18F-30-C3-R0 The **ATS-18F-30-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **maxiFLOW™** series, designed to provide high thermal performance in restricted airflow environments. --- ### 1. Key Technical Specifications | Feature | Specification | |:---|:---| | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Product Series** | maxiFLOW™ | | **Material** | Aluminum (Black Anodized) | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Thermal Resistance** | 1.35°C/W (at 200 LFM) | | **Dimensions (L x W x H)** | 57.00mm x 57.00mm x 25.00mm | | **Thermal Interface Material (TIM)** | T412 (High-performance pre-applied pad) | --- ### 2. Component Breakdown #### A. The Fin Design (maxiFLOW™) Unlike standard extruded heat sinks, this part uses a **flared fin geometry**. This design maximizes the surface area for convective heat transfer while minimizing pressure drop. It is particularly effective in systems where air is forced across the board. #### B. The Attachment System (pushPIN™) The "R0" suffix refers to the specific attachment kit. This part uses a **brass push-pin** mechanism: * **Ease of Assembly:** Features a flexible, built-in spring that provides precise pressure to the processor or component. * **Stability:** Ensures the heat sink remains in contact with the heat source even under mechanical shock or vibration. #### C. Thermal Interface Material (TIM) The unit comes pre-applied with **T412**. This is a phase-change material or high-performance pad that fills microscopic air gaps between the heat sink base and the electronic component (CPU/GPU/FPGA), significantly reducing thermal resistance. --- ### 3. Application Use Cases This part is commonly used to cool high-power integrated circuits, such as: 1. **Network Switches and Routers:** Where dense packaging requires high airflow efficiency. 2. **FPGA/ASIC Cooling:** For high-speed data processing units that generate significant heat. 3. **Industrial Power Supplies:** Where mechanical reliability and thermal dissipation are critical. --- ### 4. Performance Metrics Thermal performance varies based on the Air Velocity (Measured in Linear Feet per Minute - LFM): | Air Velocity (LFM) | Thermal Resistance (°C/W) | |:---|:---| | 200 (1.0 m/s) | 1.35 | | 400 (2.0 m/s) | 0.85 | | 600 (3.0 m/s) | 0.60 |