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  • ATS-18F-33-C3-R0

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    The **ATS-18F-33-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications The part number contains specific encoded data regarding its physical and thermal characteristics: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ HS | | **Material** | Aluminum | | **Attachment Method** | Push-Pin (Spring-loaded) | | **Dimensions (L x W x H)** | 35.00mm x 35.00mm x 20.00mm | | **Thermal Resistance** | 17.50° C/W (at 100 LFM) | | **Fin Style** | Straight Fin | | **Finish** | Blue Anodized | --- ### 2. Key Features and Components * **pushPIN™ Attachment:** This model uses a push-pin mechanism combined with a stainless steel spring. This ensures high pressure for better thermal contact and makes installation tool-free and repeatable. * **Material Science:** Constructed from **6063-T5 aluminum**, which provides a high thermal conductivity-to-weight ratio. * **Pre-Applied Thermal Interface Material (TIM):** This specific model typically comes with **T412** thermal tape or grease pre-applied to the base to ensure immediate high-performance heat transfer from the chip to the sink. * **Fin Geometry:** The "Straight Fin" design is optimized for environments with a steady directional airflow, allowing air to pass through the channels and carry away heat efficiently. --- ### 3. Application Use-Cases This heat sink is commonly used in the following electronic sectors: 1. **Telecommunications:** Cooling of networking switches and routers. 2. **Industrial PC:** Thermal management for embedded processors in compact enclosures. 3. **Power Electronics:** Dissipating heat from MOSFETs or IGBTs in power supply units. --- ### 4. Thermal Performance Overview | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 17.50 | | 300 (1.5 m/s) | 7.92 | | 500 (2.5 m/s) | 5.30 | | 700 (3.5 m/s) | 4.23 |
    ✨ Follow-up Questions
    • ⤷ What is the difference between Blue Anodized and Black Anodized finishes in thermal performance?
    • ⤷ How do I calculate the required LFM for my specific chip wattage?
    • ⤷ Can the push-pin size be customized for different PCB thicknesses?