ATS-18F-33-C3-R0
AI

The **ATS-18F-33-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors.
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### 1. Technical Specifications
The part number contains specific encoded data regarding its physical and thermal characteristics:
| Parameter | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Series** | pushPIN™ HS |
| **Material** | Aluminum |
| **Attachment Method** | Push-Pin (Spring-loaded) |
| **Dimensions (L x W x H)** | 35.00mm x 35.00mm x 20.00mm |
| **Thermal Resistance** | 17.50° C/W (at 100 LFM) |
| **Fin Style** | Straight Fin |
| **Finish** | Blue Anodized |
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### 2. Key Features and Components
* **pushPIN™ Attachment:** This model uses a push-pin mechanism combined with a stainless steel spring. This ensures high pressure for better thermal contact and makes installation tool-free and repeatable.
* **Material Science:** Constructed from **6063-T5 aluminum**, which provides a high thermal conductivity-to-weight ratio.
* **Pre-Applied Thermal Interface Material (TIM):** This specific model typically comes with **T412** thermal tape or grease pre-applied to the base to ensure immediate high-performance heat transfer from the chip to the sink.
* **Fin Geometry:** The "Straight Fin" design is optimized for environments with a steady directional airflow, allowing air to pass through the channels and carry away heat efficiently.
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### 3. Application Use-Cases
This heat sink is commonly used in the following electronic sectors:
1. **Telecommunications:** Cooling of networking switches and routers.
2. **Industrial PC:** Thermal management for embedded processors in compact enclosures.
3. **Power Electronics:** Dissipating heat from MOSFETs or IGBTs in power supply units.
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### 4. Thermal Performance Overview
| Air Velocity (LFM) | Thermal Resistance (°C/W) |
| :--- | :--- |
| 100 (0.5 m/s) | 17.50 |
| 300 (1.5 m/s) | 7.92 |
| 500 (2.5 m/s) | 5.30 |
| 700 (3.5 m/s) | 4.23 |
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What is the difference between Blue Anodized and Black Anodized finishes in thermal performance?
- ⤷ How do I calculate the required LFM for my specific chip wattage?
- ⤷ Can the push-pin size be customized for different PCB thicknesses?