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  • ATS-18F-34-C3-R0

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    The **ATS-18F-34-C3-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) Heatsink**. It belongs to the *maxiFLOW™* series, designed for cooling high-power electronic components like CPUs, GPUs, and ASICs in constrained airflow environments. --- ## 1. Key Specifications The following table highlights the primary mechanical and thermal properties of this specific part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum (Anodized Blue) | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W x H)** | 57.60mm x 76.20mm x 22.86mm | | **Thermal Resistance** | 3.90°C/W (at 200 LFM) | | **Fin Style** | maxiFLOW (Tapered Fin Design) | | **Thermal Interface Material (TIM)** | T412 (High Performance) | --- ## 2. Component Analysis ### A. The maxiFLOW™ Design The core electronic benefit of this part is its **tapered fin structure**. Unlike standard vertical fins, these fins are angled to: * Increase surface area for heat dissipation. * Reduce pressure drop across the component. * Allow air to flow more effectively through the fins rather than around them. ### B. Thermal Interface Material (TIM) The part comes pre-applied with **T412**, which is a high-quality thermal pad/grease substitute. In electronics, this is critical because it fills the microscopic air gaps between the heat-generating semiconductor and the aluminum heatsink, ensuring efficient thermal transfer. ### C. pushPIN™ Mounting System For PCB assembly, the "pushPIN" system is vital. It uses a brass or plastic pin with a high-tension spring. This ensures: 1. **Uniform Pressure:** Prevents "tilting" which could crack a fragile silicon die. 2. **Vibration Resistance:** Securely holds the heatsink during shipping or mechanical vibration. --- ## 3. Part Number Breakdown The nomenclature `ATS-18F-34-C3-R0` follows a specific logic: * **ATS:** Advanced Thermal Solutions (Brand). * **18:** Series/Physical footprint identifier. * **F:** Fin pitch/density indicator. * **34:** Specific height and geometry variant. * **C3:** Denotes the **Blue Anodized** finish and specific thermal performance grade. * **R0:** RoHS compliance status and revision level. ---
    ✨ Follow-up Questions
    • ⤷ What are the airflow requirements to achieve optimal cooling with this heatsink?
    • ⤷ Can the T412 thermal interface material be replaced with liquid metal?
    • ⤷ Is this heatsink compatible with standard BGA or LGA socket layouts?