ATS-18F-34-C3-R0
AI

The **ATS-18F-34-C3-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) Heatsink**. It belongs to the *maxiFLOW™* series, designed for cooling high-power electronic components like CPUs, GPUs, and ASICs in constrained airflow environments.
---
## 1. Key Specifications
The following table highlights the primary mechanical and thermal properties of this specific part:
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Material** | Aluminum (Anodized Blue) |
| **Attachment Method** | pushPIN™ (Spring-loaded) |
| **Dimensions (L x W x H)** | 57.60mm x 76.20mm x 22.86mm |
| **Thermal Resistance** | 3.90°C/W (at 200 LFM) |
| **Fin Style** | maxiFLOW (Tapered Fin Design) |
| **Thermal Interface Material (TIM)** | T412 (High Performance) |
---
## 2. Component Analysis
### A. The maxiFLOW™ Design
The core electronic benefit of this part is its **tapered fin structure**. Unlike standard vertical fins, these fins are angled to:
* Increase surface area for heat dissipation.
* Reduce pressure drop across the component.
* Allow air to flow more effectively through the fins rather than around them.
### B. Thermal Interface Material (TIM)
The part comes pre-applied with **T412**, which is a high-quality thermal pad/grease substitute. In electronics, this is critical because it fills the microscopic air gaps between the heat-generating semiconductor and the aluminum heatsink, ensuring efficient thermal transfer.
### C. pushPIN™ Mounting System
For PCB assembly, the "pushPIN" system is vital. It uses a brass or plastic pin with a high-tension spring. This ensures:
1. **Uniform Pressure:** Prevents "tilting" which could crack a fragile silicon die.
2. **Vibration Resistance:** Securely holds the heatsink during shipping or mechanical vibration.
---
## 3. Part Number Breakdown
The nomenclature `ATS-18F-34-C3-R0` follows a specific logic:
* **ATS:** Advanced Thermal Solutions (Brand).
* **18:** Series/Physical footprint identifier.
* **F:** Fin pitch/density indicator.
* **34:** Specific height and geometry variant.
* **C3:** Denotes the **Blue Anodized** finish and specific thermal performance grade.
* **R0:** RoHS compliance status and revision level.
---
- ⤷
What are the airflow requirements to achieve optimal cooling with this heatsink?
- ⤷ Can the T412 thermal interface material be replaced with liquid metal?
- ⤷ Is this heatsink compatible with standard BGA or LGA socket layouts?