The **ATS-18F-35-C3-R0** is a high-performance electronic thermal management component, specifically a **Heatsink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic integrated circuits (ICs) to prevent overheating. --- ### 1. Technical Specifications The part number itself contains specific parameters regarding its physical and thermal characteristics. | Feature | Specification | | :--- | :--- | | **Component Type** | Push-Pin Heatsink | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | Push-Pin (Plastic) | | **Spring Type** | Compression Spring | | **Dimensions** | 35mm x 35mm x 10mm | | **Fin Style** | Fine Pitch (Straight Fin) | | **Thermal Resistance** | ~12.50 °C/W (Unducted Flow) | | **Thermal Interface Material** | T412 (Double-sided adhesive/pad) | --- ### 2. Design Breakdown #### A. Attachment Mechanism (Push-Pin) Unlike adhesive-only heatsinks, the "18F" series utilizes a **Push-Pin** system. - **Drilled Holes:** The PCB must have pre-drilled holes to accept the pins. - **Spring Tension:** A built-in spring provides consistent pressure, ensuring the heatsink maintains optimal contact with the component surface, even under vibration. #### B. Material and Coating - **Aluminum 6063:** Chosen for its excellent thermal conductivity and lightweight properties. - **Blue Anodization:** This is not just for aesthetics; the anodized finish increases emissivity (the ability to radiate heat) and provides electrical insulation and corrosion resistance. #### C. Fin Geometry The "35" in the part number denotes the footprint (35mm). The fins are designed for **straight-line airflow**. This makes it ideal for devices inside a chassis where a fan provides a specific direction of air movement. --- ### 3. Common Applications This specific heatsink is typically found in: * **Telecommunications:** Cooling network processors and high-speed switches. * **Embedded Systems:** Industrial PCs and controllers. * **Power Supplies:** Cooling MOSFETs or voltage regulators. * **FPGA/ASIC Cooling:** Protecting high-gate-count chips from thermal throttling. --- ### 4. Thermal Performance Overview The efficiency of the ATS-18F-35-C3-R0 is highly dependent on **Air Velocity (LFM)**. | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 (Natural/Low) | 12.5 | | 400 (Moderate) | 4.4 | | 600 (High) | 3.3 | ---