The **ATS-18F-37-C2-R0** is a high-performance electronic thermal management component, specifically a **Heatsink** designed for cooling integrated circuits (ICs) and other electronic packages. It is manufactured by *Advanced Thermal Solutions, Inc. (ATS)*. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics. | Parameter | Specification | |:---|:---| | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic/Brass) | | **Thermal Resistance** | 9.12°C/W (at 100 LFM) | | **Dimensions (L x W x H)** | 36.83mm x 36.83mm x 22.86mm | | **TIM (Thermal Interface Material)** | T766 (Pre-applied) | --- ### 2. Design and Components This part is not just a block of metal; it is an engineered system consisting of several electronic-cooling elements: * **Fin Style:** It utilizes **Straight Fins**, which are optimized for unidirectional airflow. * **Thermal Interface Material (TIM):** It comes with **T766** pre-applied to the base. This is a phase-change material that ensures maximum heat transfer from the electronic component (CPU, GPU, or FPGA) to the aluminum sink. * **Push-Pin Mounting:** Unlike adhesive-based sinks, this uses a mechanical push-pin system. This ensures consistent pressure across the component, which is vital for thermal efficiency and prevents the sink from falling off due to vibration or heat cycles. --- ### 3. Thermal Performance Profile The efficiency of this part depends on the airflow (measured in Linear Feet per Minute - LFM) within the electronic enclosure. | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | |:---:|:---:| | 100 (0.5 m/s) | 9.12 | | 300 (1.5 m/s) | 3.19 | | 500 (2.5 m/s) | 2.11 | | 700 (3.5 m/s) | 1.62 | --- ### 4. Application Use Cases This specific model is typically found in: 1. **Telecommunications:** High-speed routers and switches. 2. **Embedded Systems:** Industrial PCs and automation controllers. 3. **Power Electronics:** Voltage regulators and power modules that generate significant heat in a small footprint.