The **ATS-18F-40-C3-R0** is a high-performance electronic thermal management component, specifically a **Heatsink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Series** | pushPIN™ | | **Thermal Resistance** | 1.50°C/W (at 200 LFM) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Dimensions** | 47.00mm x 47.00mm x 25.00mm | --- ### 2. Physical Design & Construction * **Fin Style:** This model typically features a **cross-cut** or **straight fin** design (the "F" in the part number indicates the fin pattern). This increases surface area for convection. * **Material:** Made from high-grade aluminum, which offers an excellent balance between thermal conductivity and weight. * **Blue Anodized Coating:** The blue finish is not just for aesthetics; it provides surface protection against corrosion and slightly improves radiant heat transfer. --- ### 3. Attachment Mechanism: pushPIN™ One of the defining "parts" of this assembly is the attachment system: * **Push-Pins:** Plastic or brass pins that snap into pre-drilled holes on the PCB. * **Compression Springs:** These are wrapped around the push-pins to ensure constant, even pressure between the heatsink base and the chip. * **Thermal Interface Material (TIM):** This specific part usually comes with **T412** thermal tape or a pre-applied phase-change material to fill microscopic air gaps between the component and the heatsink. --- ### 4. Typical Applications This heatsink is commonly used in environments where airflow is managed, such as: 1. **Telecommunications:** High-speed routers and switches. 2. **Embedded Systems:** Industrial PCs and automation controllers. 3. **Power Electronics:** Large MOSFET arrays or power modules.