## Overview of ATS-18F-45-C3-R0 The **ATS-18F-45-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "pushPIN™" series, designed for efficient cooling of surface-mount electronic components like CPUs, GPUs, or power regulators. --- ### 1. Technical Specifications | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Product Series** | pushPIN™ | | **Heat Sink Type** | Fin-Type (Straight Fin) | | **Material** | Aluminum (AL6063) | | **Attachment Method** | Push Pin (Spring-loaded) | | **Dimensions** | 30mm x 30mm | | **Height (Fin)** | 25mm | | **Finish** | Blue Anodized | | **Thermal Interface Material (TIM)** | T412 (Phase-change or high-performance pad) | --- ### 2. Physical Design Features * **Fin Geometry:** Features a straight-fin design that allows for maximum surface area while facilitating airflow from cooling fans. * **Push-Pin Attachment:** The "R0" designation refers to the attachment kit. It uses a flexible, spring-loaded mechanism that ensures even pressure across the chip, improving thermal transfer and preventing mechanical damage during vibration. * **Material:** Constructed from high-quality Aluminum 6063, which provides a balance between weight and thermal conductivity. * **Anodized Finish:** The Blue Anodized coating is not just aesthetic; it provides corrosion resistance and increases surface emissivity for better radiant heat loss. --- ### 3. Thermal Performance Data Thermal resistance is measured in °C/W (Degrees Celsius per Watt). A lower number indicates better cooling efficiency. | Airflow Velocity (LFM) | Thermal Resistance (Unducted) | Thermal Resistance (Ducted) | | :--- | :--- | :--- | | 100 LFM (0.5 m/s) | ~7.00 °C/W | ~2.50 °C/W | | 300 LFM (1.5 m/s) | ~3.00 °C/W | ~1.60 °C/W | | 500 LFM (2.5 m/s) | ~2.10 °C/W | ~1.30 °C/W | --- ### 4. Part Number Breakdown Understanding the nomenclature helps in identifying variants: * **ATS:** Manufacturer (Advanced Thermal Solutions). * **18:** Series number. * **F:** Fin pitch/style (e.g., Fine). * **45:** Specific geometry/sizing identifier. * **C3:** Material/Finish/Hardware combination. * **R0:** Revision or packaging/kit status. --- ### 5. Application Use Cases 1. **Telecommunications:** Cooling network switches and routers. 2. **Industrial PCs:** Heat dissipation for processors in fanless or low-airflow environments. 3. **Power Electronics:** Cooling MOSFETs or IGBTs in power supply units. 4. **Embedded Systems:** High-density PCBs where vertical space is available but footprint is limited (30x30mm).