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  • ATS-18F-51-C2-R0

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    The **ATS-18F-51-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **maxiFLOW™** product line, known for its high-aspect-ratio fin design. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of the part: | Characteristic | Specification | | :--- | :--- | | **Material** | Aluminum (Blue Anodized) | | **Dimensions (L x W x H)** | 45mm x 45mm x 20mm | | **Attachment Method** | pushPIN™ (Brass pins / Steel springs) | | **Thermal Resistance** | 6.69°C/W (@ 1.0 m/s flow) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | | **Fin Style** | maxiFLOW (Tapered) | --- ### 2. Key Component Features #### A. Fin Design (maxiFLOW™) Unlike standard extruded heat sinks, the maxiFLOW™ design features a tapered fin structure. This increases the surface area while reducing pressure drop, making it highly efficient for constrained airflow environments. #### B. Attachment System (pushPIN™) The part uses a specialized **pushPIN™** mechanism. This is critical for electronic stability because: * It provides a precise, calculated force to ensure optimal contact with the processor/component. * It prevents "over-tightening" which can crack delicate silicon dies. * The hardware is typically comprised of a stainless steel spring and a brass/plastic pin. #### C. Thermal Interface Material (TIM) The **C2** in the part number indicates the specific TIM applied to the base. In this case, it is **T766**, a high-performance thermal grease that fills microscopic air gaps between the component and the heat sink to maximize heat transfer. --- ### 3. Electronic Applications This specific part is generally used to cool the following types of electronic components: * **FPGAs & ASICs:** High-speed processing units that generate localized heat. * **Network Switches:** Components requiring low-profile cooling due to rack-space constraints. * **CPUs/GPUs:** Small form-factor embedded processors. --- ### 4. Part Number Breakdown * **ATS:** Advanced Thermal Solutions (Manufacturer) * **18F:** Series designation (maxiFLOW with pushPIN) * **51:** Specific footprint/height configuration * **C2:** Thermal Interface Material (T766) * **R0:** Revision code / RoHS Compliance status
    ✨ Follow-up Questions
    • ⤷ What are the alternative attachment methods if pushPIN is not suitable for my PCB?
    • ⤷ How does the T766 TIM compare to other thermal pads in terms of conductivity?
    • ⤷ Can this heat sink be used in natural convection environments without a fan?