ATS-18F-51-C2-R0
AI

The **ATS-18F-51-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **maxiFLOW™** product line, known for its high-aspect-ratio fin design.
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### 1. Technical Specifications
Below are the primary physical and thermal characteristics of the part:
| Characteristic | Specification |
| :--- | :--- |
| **Material** | Aluminum (Blue Anodized) |
| **Dimensions (L x W x H)** | 45mm x 45mm x 20mm |
| **Attachment Method** | pushPIN™ (Brass pins / Steel springs) |
| **Thermal Resistance** | 6.69°C/W (@ 1.0 m/s flow) |
| **Thermal Interface Material (TIM)** | T766 (Pre-applied) |
| **Fin Style** | maxiFLOW (Tapered) |
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### 2. Key Component Features
#### A. Fin Design (maxiFLOW™)
Unlike standard extruded heat sinks, the maxiFLOW™ design features a tapered fin structure. This increases the surface area while reducing pressure drop, making it highly efficient for constrained airflow environments.
#### B. Attachment System (pushPIN™)
The part uses a specialized **pushPIN™** mechanism. This is critical for electronic stability because:
* It provides a precise, calculated force to ensure optimal contact with the processor/component.
* It prevents "over-tightening" which can crack delicate silicon dies.
* The hardware is typically comprised of a stainless steel spring and a brass/plastic pin.
#### C. Thermal Interface Material (TIM)
The **C2** in the part number indicates the specific TIM applied to the base. In this case, it is **T766**, a high-performance thermal grease that fills microscopic air gaps between the component and the heat sink to maximize heat transfer.
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### 3. Electronic Applications
This specific part is generally used to cool the following types of electronic components:
* **FPGAs & ASICs:** High-speed processing units that generate localized heat.
* **Network Switches:** Components requiring low-profile cooling due to rack-space constraints.
* **CPUs/GPUs:** Small form-factor embedded processors.
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### 4. Part Number Breakdown
* **ATS:** Advanced Thermal Solutions (Manufacturer)
* **18F:** Series designation (maxiFLOW with pushPIN)
* **51:** Specific footprint/height configuration
* **C2:** Thermal Interface Material (T766)
* **R0:** Revision code / RoHS Compliance status
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What are the alternative attachment methods if pushPIN is not suitable for my PCB?
- ⤷ How does the T766 TIM compare to other thermal pads in terms of conductivity?
- ⤷ Can this heat sink be used in natural convection environments without a fan?