The **ATS-18F-52-C3-R0** is a high-performance electronic thermal management component, specifically a **Heatsink** designed by Advanced Thermal Solutions (ATS). It is part of the "push pin" attachment series, commonly used to cool integrated circuits (ICs) such as CPUs, GPUs, and FPGAs. --- ### 1. Technical Specifications Below are the primary physical and thermal properties of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Anodized Blue) | | **Dimensions (L x W x H)** | 35.0mm x 35.0mm x 25.0mm | | **Fin Style** | Straight Fin | | **Attachment Method** | Push-Pin (Plastic) | | **Spring Type** | Compression Spring | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Key Component Parts #### A. The Heatsink Body Manufactured from high-grade aluminum, the body features a "straight-fin" design. This geometry is optimized for **forced air cooling** (where a fan is present). The blue anodized finish provides both aesthetic value and protection against corrosion. #### B. The Push-Pin Mechanism Unlike adhesive-based heatsinks, the `ATS-18F-52-C3-R0` uses a mechanical push-pin system. - **Push-Pins:** Usually made of nylon or plastic, these snap into pre-drilled holes in the Printed Circuit Board (PCB). - **Springs:** These ensure constant downward pressure on the electronic chip, which is vital for maintaining high thermal conductivity. #### C. Thermal Interface Material (TIM) The base of the heatsink comes pre-applied with **T766 phase-change material**. This eliminates the need for manual thermal paste application, ensuring a uniform bond between the silicon die and the aluminum base. --- ### 3. Thermal Performance Thermal resistance is measured in °C/W (Degrees Celsius per Watt). The performance of this part varies based on the airflow velocity: | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 LFM (1.0 m/s) | 7.33 | | 400 LFM (2.0 m/s) | 4.10 | | 600 LFM (3.0 m/s) | 3.33 | --- ### 4. Typical Applications * **Networking:** Routers, switches, and modems. * **Embedded Systems:** Industrial PC boards and single-board computers. * **Power Supplies:** Heat dissipation for voltage regulators.