## ATS-18F-54-C2-R0 Technical Overview The **ATS-18F-54-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "pushPIN™" line, designed to provide efficient cooling for electronic components like processors, ASICs, and FPGAs. --- ### 1. Key Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Heat Sink Type** | Push Pin | | **Attachment Method** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | 6.17°C/W (at 100 LFM) | | **Dimensions (L x W x H)** | 35.00mm x 35.00mm x 35.00mm | | **Pitch** | Fine Pitch | --- ### 2. Physical Design & Construction The unit is engineered for maximum surface area and airflow efficiency. * **Fine Pitch Fins:** The "F" in the part number indicates a fine-pitch fin pattern. This increases the surface area, allowing for better heat dissipation in systems with consistent airflow. * **Aluminum Body:** Provides a balance between high thermal conductivity, low weight, and cost-effectiveness. * **Blue Anodized Finish:** Not only provides an aesthetic look but also increases the surface emissivity, slightly improving radiation cooling and protecting against corrosion. --- ### 3. Attachment Mechanism (pushPIN™) One of the defining electronic integration features of this part is the **pushPIN™** system: 1. **Ease of Assembly:** It uses a flexible, spring-loaded mechanism that snaps into pre-drilled holes on the PCB (Printed Circuit Board). 2. **Consistent Pressure:** The spring ensures that the heat sink maintains firm, uniform contact with the component (usually via a thermal interface material), which is critical for heat transfer. 3. **Secure Fit:** The "R0" designation refers to a specific attachment hardware configuration that ensures the heat sink remains stable under vibration or mechanical shock. --- ### 4. Thermal Performance Thermal resistance varies based on the airflow (velocity) within the electronics enclosure: * **@100 LFM (Linear Feet per Minute):** 6.17 °C/W * **@200 LFM:** 3.47 °C/W * **@500 LFM:** 1.88 °C/W *Note: A lower °C/W value indicates better cooling performance as air speed increases.*