The **ATS-18F-55-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like BGA (Ball Grid Array) processors and power modules. --- ## 1. Technical Specifications The part number follows a specific nomenclature used by ATS to define the dimensions and thermal characteristics. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Type** | Board Level Heat Sink | | **Attachment Method** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 35.00mm x 35.00mm x 10.00mm | | **Thermal Resistance** | 23.98°C/W (Unducted Flow @ 100 LFM) | | **Airflow Pattern** | Cross-Cut | --- ## 2. Key Components & Design ### A. pushPIN™ Attachment System This part uses a specific mounting mechanism designed for high vibration environments. * **Springs:** Pre-assembled with a compression spring to ensure consistent pressure on the component. * **Pins:** Features brass or plastic pins that lock into pre-drilled holes on the PCB. ### B. Thermal Interface Material (TIM) The "C2" in the part number indicates the type of thermal interface. * **ATS-PPS-18:** Often signifies a pre-applied high-performance thermal phase-change material or grease. * **Efficiency:** This ensures the microscopic gaps between the chip and the heat sink are filled, maximizing heat transfer. ### C. Cross-Cut Fin Design The fin structure is "Cross-Cut," meaning it is divided into a grid of small squares or rectangles. * **Omnidirectional Airflow:** This allows the heat sink to be cooled by airflow coming from any direction, unlike straight-fin heat sinks which require directional air. --- ## 3. Applications This heat sink is typically found in the following electronic systems: 1. **Networking Hardware:** Routers, switches, and modems. 2. **Power Supplies:** High-density power modules. 3. **Embedded Systems:** Industrial PCs and controllers. 4. **FPGA/ASIC Cooling:** Integrated circuits that generate significant heat in a small footprint. --- ## 4. Ordering Information (Part Number Breakdown) | Segment | Meaning | | :--- | :--- | | **ATS-18** | Product series / Attachment type | | **F** | Fin style (Fine/Cross-cut) | | **55** | Specific geometry/series code | | **C2** | Thermal material / finish type | | **R0** | RoHS compliant / Revision |