The **ATS-18F-60-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the blue-anodized "push-pin" series designed for cooling Integrated Circuits (ICs). --- ### 1. Technical Specifications The following table summarizes the primary physical and thermal characteristics of the component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Part Number** | ATS-18F-60-C2-R0 | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Dimensions** | 36.83mm x 36.83mm x 25.00mm | | **Attachment Method** | Push-Pin (Brass) | | **Spring Type** | Compression Spring | | **Thermal Resistance** | 1.45°C/W (at 200 LFM) | --- ### 2. Key Features and Design #### A. Fin Geometry * **Design:** The heat sink utilizes a **Straight Fin** design. * **Function:** Straight fins allow for consistent airflow in a specific direction, making them ideal for systems with clear intake and exhaust paths. #### B. Attachment Mechanism (Push-Pin) Unlike adhesive-based heat sinks, the **ATS-18F-60-C2-R0** uses a mechanical fastening system: * **Push-Pins:** Two brass pins are pushed through pre-drilled holes in the PCB. * **Compression Springs:** These ensure a consistent downward force on the component (CPU, FPGA, etc.), maximizing contact with the thermal interface material (TIM). #### C. Material and Coating * **Aluminum 6063:** Chosen for its excellent thermal conductivity and lightweight properties. * **Blue Anodizing:** This is not just for aesthetics; it provides corrosion resistance and increases the surface emissivity, slightly improving radiation cooling. --- ### 3. Thermal Performance Profile Thermal resistance is critical for determining how much heat the part can dissipate. For the ATS-18F-60-C2-R0, performance varies by airflow speed: | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **200 (1.0 m/s)** | 1.45 | | **300 (1.5 m/s)** | 1.15 | | **400 (2.0 m/s)** | 1.00 | --- ### 4. Typical Applications This specific model is frequently found in high-heat density electronic environments: 1. **Networking Hardware:** Switches and Routers. 2. **Industrial Computing:** Embedded systems and Single Board Computers (SBCs). 3. **Power Electronics:** Power supplies and MOSFET modules. 4. **Processors:** Cooling for FPGAs and ASICs that generate significant localized heat.