The **ATS-18F-61-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ## 1. Technical Specifications The following table outlines the physical and thermal characteristics of this specific part number: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-18F-61-C2-R0 | | **Heat Sink Type** | Push-Pin (Passive Cooling) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | 4.97°C/W (at 200 LFM) | | **Dimensions (L x W x H)** | 40.00mm x 40.00mm x 10.00mm | | **Attachment Method** | Push-Pin (Plastic) with Compression Spring | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ## 2. Component Design Breakdown ### A. Fin Geometry (Straight Fin) This part utilizes a **Straight Fin** design. Straight fins provide a high surface area-to-volume ratio, making them ideal for systems where there is a consistent, directed airflow (forced convection). ### B. Push-Pin Attachment System Unlike adhesive-based heat sinks, the "Push-Pin" mechanism ensures a secure mechanical connection to the PCB. * **Plastic Push-Pins:** These snap into pre-drilled holes in the motherboard/PCB. * **Compression Springs:** These apply a precise amount of downward pressure (load) on the component, ensuring maximum contact with the Thermal Interface Material. ### C. Material and Finish * **Aluminum:** Chosen for its excellent thermal conductivity-to-weight ratio and cost-effectiveness. * **Blue Anodizing:** This is not just for aesthetics; the anodized layer provides increased corrosion resistance and slightly improves "emissivity," which aids in radiant heat transfer. --- ## 3. Performance Metrics The effectiveness of the ATS-18F-61-C2-R0 is measured by its **Thermal Resistance**. Lower resistance means better heat dissipation. * **Unducted Flow (300 LFM):** Resistance drops to approximately **3.93°C/W**. * **Unducted Flow (500 LFM):** Resistance drops to approximately **3.03°C/W**. --- ## 4. Part Number Decoder The part number follows the standard ATS nomenclature: * **ATS:** Advanced Thermal Solutions. * **18:** Series/Configuration. * **F:** Fin Type (Fine/High density). * **61:** Specific dimensions/profile. * **C2:** Material/Finish (Aluminum/Blue Anodized). * **R0:** RoHS Compliance/Revision level.