The **ATS-18F-62-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### Technical Specifications Below are the key electronic and physical specifications for this part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (AL6063) | | **Attachment Method** | Push-Pin (Spring-loaded) | | **Thermal Resistance (Flowing)** | 1.64 °C/W @ 100 LFM | | **Thermal Resistance (Static)** | 6.46 °C/W | | **Dimensions (L x W x H)** | 40mm x 40mm x 15mm | | **Finish** | Blue Anodized | | **TIM (Thermal Interface Material)** | T766 (Pre-applied) | --- ### Key Features and Component Design #### 1. Push-Pin Mounting System Unlike adhesive-based heat sinks, the "pushPIN" system uses a flexible, spring-loaded mechanism. This ensures: * **Constant Pressure:** Maintains uniform contact between the heat sink and the chip. * **Reliability:** Prevents the heat sink from shifting during vibration or shipping. #### 2. Fin Design (Cross-Cut) The unit features a **straight-fin** or **cross-cut** geometry. This design is optimized for airflow from multiple directions, making it efficient in tight PCB layouts where air currents might be turbulent. #### 3. Thermal Interface Material (TIM) The part comes with **T766** pre-applied. In electronics, the TIM is crucial because it fills microscopic air gaps between the component and the heat sink, significantly lowering the thermal resistance. #### 4. Material and Finish * **Aluminum 6063:** Chosen for its high thermal conductivity and lightweight properties. * **Blue Anodized Coating:** Provides corrosion resistance and slightly improves radiative heat transfer. --- ### Applications in Electronics This specific size and thermal profile are commonly used for: * **FPGA & ASICs:** High-speed processing chips. * **Telecommunications:** Network switches and routers. * **Industrial Power Supplies:** Cooling voltage regulators and power MOSFETs.