The **ATS-18F-67-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power semiconductors. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W)** | 45mm x 45mm | | **Height (H)** | 10mm | | **Thermal Resistance** | ~11.0°C/W (at 200 LFM) | | **Thermal Interface Material** | T766 (Pre-applied) | --- ### 2. Key Components & Features #### A. Fin Design (Cross-Cut) This model features a **Cross-Cut** fin pattern. Unlike straight fins, cross-cut fins allow for "multi-directional" airflow. This makes the heat sink effective even if the airflow direction is inconsistent or restricted within the enclosure. #### B. pushPIN™ Attachment System The part utilizes the **pushPIN™** system, which consists of: * **Brass/Plastic Pins:** Used to secure the sink to the PCB. * **Compression Springs:** Ensure consistent pressure on the component (IC) to maximize heat transfer. * **Pre-drilled Holes:** Requires specific hole patterns on the PCB for mounting. #### C. Thermal Interface Material (TIM) The heat sink comes with **T766** phase-change material pre-applied to the bottom surface. This eliminates the need for manual application of thermal paste and ensures a low-resistance path between the component and the aluminum fins. --- ### 3. Application Use Cases This specific heat sink is typically used in space-constrained environments where low-profile cooling is required: * **Telecommunications:** Network switches and routers. * **Embedded Computing:** Industrial PC boards. * **Power Supplies:** Cooling MOSFETs or voltage regulators. --- ### 4. Thermal Performance Comparison Typical performance based on airflow (Air Velocity): | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (Natural Conv.) | 14.50 | | 200 | 11.00 | | 400 | 7.50 | | 600 | 5.80 | ---