The part number **ATS-18F-74-C3-R0** refers to a high-performance **heat sink** manufactured by Advanced Thermal Solutions (ATS). This component belongs to the **maxiFLOW™** series, designed specifically for cooling electronic components like BGA (Ball Grid Array) packages. ### 1. Technical Specifications The following table summarizes the key physical and thermal characteristics of the part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Series** | maxiFLOW™ | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | pushPIN™ | | **Dimensions (L x W x H)** | 50mm x 50mm x 15mm | | **Thermal Resistance** | 2.03°C/W (at 200 LFM) | | **Fin Style** | Spread Fin (Tapered) | | **Compliance** | RoHS Compliant | --- ### 2. Design and Component Features #### A. Fin Geometry (maxiFLOW™) The "spread fin" design is engineered to maximize surface area and optimize airflow. The tapered fins reduce pressure drop, allowing air to flow more efficiently through the heat sink compared to standard straight-fin designs. #### B. pushPIN™ Attachment Instead of using messy thermal adhesives or tapes, this part uses the **pushPIN™** system. - It features a built-in spring mechanism. - It provides precise pressure (clamped force) on the electronic chip, ensuring optimal thermal interface material (TIM) performance. - It requires pre-drilled holes on the PCB (Printed Circuit Board). #### C. Thermal Interface Material (TIM) The **"C3"** in the part number indicates that the heat sink comes pre-applied with a high-performance **Phase Change Material (PCM)** or thermal grease. This eliminates the need for manual application during assembly and ensures a low-resistance path between the chip and the aluminum. --- ### 3. Part Number Breakdown Understanding the nomenclature helps in identifying variants: * **ATS**: Manufacturer (Advanced Thermal Solutions). * **18F**: Indicates the specific series and mounting hole configuration. * **74**: Specific internal design/dimension code. * **C3**: Thermal Interface Material (T766 or similar high-performance grease). * **R0**: Revision/Packaging code. --- ### 4. Typical Applications This electronic part is commonly used in high-heat environments where reliability is critical, including: * **Telecommunications:** Networking switches and routers. * **Computing:** High-speed processors and GPUs. * **Industrial:** Power supplies and motor controllers.