The **ATS-18F-76-C3-R0** is a high-performance electronic thermal management component, specifically a **Heatsink** designed by Advanced Thermal Solutions (ATS). It belongs to the "push-pin" series, which is engineered for secure and efficient cooling of electronic components such as CPUs, GPUs, and power modules. --- ### 1. Technical Specifications The following table summarizes the physical and thermal characteristics of this specific part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-18F-76-C3-R0 | | **Fin Type** | Straight Fin | | **Dimensions** | 25mm x 25mm x 15mm | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Thermal Resistance** | ~11.84°C/W (at 200 LFM) | | **Thermal Interface (TIM)** | T412 (Pre-applied) | --- ### 2. Key Component Breakdown #### A. The Fin Profile (Straight Fin) The "Straight Fin" design is optimized for environments with **unobstructed airflow**. The vertical fins allow air to flow through the length of the heatsink, maximizing the surface area to volume ratio for heat dissipation. #### B. Push-Pin Attachment The `-R0` suffix indicates the attachment mechanism. Push-pins provide: * **Constant Pressure:** Ensures a tight seal between the component and the heatsink. * **Ease of Assembly:** Quick installation through pre-drilled holes in the PCB. * **Mechanical Stability:** Prevents the heatsink from shifting during transport or vibration. #### C. Thermal Interface Material (TIM) The part comes pre-applied with **T412 thermal tape**. This is a high-performance conductive adhesive that eliminates the need for messy thermal grease, ensuring uniform contact between the electronic component and the aluminum base. #### D. Material and Coating The aluminum construction provides a lightweight yet thermally conductive base. The **Blue Anodized** finish is not just aesthetic; it provides: * Increased corrosion resistance. * Improved surface emissivity (radiant heat transfer). * Electrical insulation on the surface. --- ### 3. Common Applications * **Telecommunications:** Cooling of high-speed networking chips. * **Embedded Systems:** Thermal management for compact processors on motherboards. * **Power Electronics:** Heat dissipation for MOSFETs and voltage regulators.