The **ATS-18F-77-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors. --- ### ## Technical Specifications Below are the primary mechanical and thermal characteristics of this specific part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Series** | pushPIN™ | | **Attachment Method** | Push Pin (Plastic/Brass) | | **Material** | Aluminum (Blue Anodized) | | **Thermal Resistance** | 9.58°C/W (at 100 LFM) | | **Dimensions (L x W)** | 25mm x 25mm | | **Height (Fin Profile)** | 20mm | | **Fin Pattern** | Cross-Cut (Square Fins) | --- ### ### Key Design Features 1. **Cross-Cut Fin Design:** The "Square Fin" or cross-cut geometry allows for multi-directional airflow. This is particularly useful in compact electronic enclosures where airflow may not be strictly linear. 2. **pushPIN™ Attachment:** This part utilizes a spring-loaded push-pin mechanism. This ensures a consistent pressure (Force) against the electronic chip, which optimizes the thermal interface material (TIM) performance and prevents the heat sink from shifting during vibration. 3. **Thermal Interface Material (TIM):** The "C3" suffix typically indicates that the part comes pre-applied with **T412** thermal tape or a similar high-performance phase-change material, simplifying the assembly process. 4. **Material and Coating:** Made from high-grade aluminum for lightweight thermal conductivity, it is finished with a **Blue Anodize**. This coating not only prevents corrosion but also slightly increases surface emissivity for better radiant heat transfer. --- ### ### Application Use Cases This specific heat sink is categorized as a "Small Form Factor" cooling solution. It is commonly found in: * **Networking Equipment:** Routers, switches, and small gateways. * **Embedded Systems:** Industrial PCs and single-board computers (SBCs). * **Power Supplies:** Cooling voltage regulators and MOSFETs. ---