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  • ATS-18F-78-C2-R0

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    The **ATS-18F-78-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** product line, designed to provide efficient cooling for electronic components like BGAs (Ball Grid Arrays). --- ## Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-18F-78-C2-R0 | | **Attachment Method** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions** | 25mm x 25mm x 25mm | | **Thermal Resistance** | 7.71°C/W (Unducted Flow @ 200 LFM) | | **Thermal Interface Material (TIM)** | T766 (High Performance) | --- ## Key Components and Design Features ### 1. maxiFLOW™ Fin Geometry The fin design is engineered to maximize surface area while minimizing pressure drop. The "flared" fin structure allows for better airflow intake and heat dissipation compared to standard straight-fin heat sinks. ### 2. pushPIN™ Attachment System This part uses a specialized mounting mechanism: * **Speed:** Quick assembly with pre-assembled hardware. * **Security:** Uses a brass component and a stainless steel spring to ensure consistent pressure (7.0 - 10.0 PSI) on the electronic chip, optimizing heat transfer. * **Stability:** Features a "pedestal" design to prevent the heat sink from tilting or damaging the delicate PCB components. ### 3. Thermal Interface Material (TIM) The base comes pre-applied with **T766**, a high-performance thermal pad/grease. This fills the microscopic air gaps between the electronic component (CPU/FPGA/GPU) and the heat sink base to ensure maximum thermal conductivity. ### 4. Material Science * **Aluminum 6063:** Provides a lightweight structure with high thermal conductivity. * **Blue Anodized Coating:** Not only provides an aesthetic finish but also improves surface emissivity and protects the aluminum from corrosion. --- ## Performance Metrics (Typical) | Air Velocity (LFM) | Thermal Resistance (°C/W) - Unducted | | :--- | :--- | | 200 (1.0 m/s) | 7.71 | | 400 (2.0 m/s) | 3.98 | | 600 (3.0 m/s) | 3.05 | ---
    ✨ Follow-up Questions
    • ⤷ How does the pushPIN mounting system compare to adhesive tapes?
    • ⤷ What are the PCB hole requirements for installing this heat sink?
    • ⤷ Can this heat sink be used for passive cooling without a fan?