The **ATS-18F-79-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications The part number follows a specific nomenclature used by Advanced Thermal Solutions to describe its physical and thermal characteristics. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W x H)** | 25.00mm x 25.00mm x 30.00mm | | **Fin Style** | Fine Pitch (straight fins) | | **Thermal Resistance** | ~2.63°C/W (at 200 LFM) | --- ### 2. Design Characteristics The "F" in the part number indicates it belongs to the **pushPIN™** series, which is popular for its ease of assembly and reliable mounting pressure. * **Thermal Interface Material (TIM):** This specific model typically comes pre-applied with **T412**, a high-performance thermal tape/pad, to ensure efficient heat transfer from the chip to the aluminum fins. * **pushPIN™ Technology:** Uses a flexible attachment system that includes a brass or plastic pin and a stainless steel spring. This ensures consistent pressure across the component surface, preventing damage while maximizing thermal contact. * **Fin Geometry:** The 30mm height provides a large surface area relative to its 25mm footprint, making it ideal for systems with high vertical clearance but limited board space. --- ### 3. Applications This part is commonly used in industrial and consumer electronics where heat density is high: * **Network Switches/Routers:** Cooling ASICs and high-speed processors. * **Embedded Systems:** For single-board computers or industrial controllers. * **Power Supplies:** Cooling voltage regulators or power MOSFETs. --- ### 4. Thermal Performance Data *Measured in degrees Celsius per Watt (°C/W) based on airflow (LFM):* | Airflow Velocity | Thermal Resistance (°C/W) | | :--- | :--- | | **Unducted (Natural)** | 7.22 | | **200 LFM (1.0 m/s)** | 2.63 | | **400 LFM (2.0 m/s)** | 1.80 | | **600 LFM (3.0 m/s)** | 1.50 |