The **ATS-18F-82-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, designed for high-efficiency cooling of surface-mount components like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of the part: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Dimension (Length x Width)** | 30mm x 30mm | | **Height** | 25mm | | **Thermal Resistance** | 2.52 °C/W @ 200 LFM | | **Airflow Path** | High-performance spread fin pattern | --- ### 2. Design Breakdown The "electronic parts" of this assembly include more than just the metal block. The full assembly consists of: * **The Heat Sink Body:** Features a "flared fin" design. Unlike standard straight fins, these spread outwards to maximize surface area and improve the intake of airflow from various angles. * **The Interface Material (TIM):** This specific model typically comes pre-applied with **T412**, a high-performance thermal interface material (thermal tape/pad) that ensures no air gaps exist between the heat sink and the electronic chip. * **pushPIN™ Fasteners:** These are the mechanical components that secure the heat sink to the PCB. They use a stainless steel or plastic pin with a compression spring to provide precise, consistent pressure on the electronic component. --- ### 3. Part Number Decoder Understanding the "electronic part" nomenclature helps in identifying its specific application: | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer (Advanced Thermal Solutions) | | **18F** | maxiFLOW™ Series (Specific fin geometry) | | **82** | Specific mechanical/footprint code | | **C3** | Thermal Interface Material (TIM) type / Performance Grade | | **R0** | Revision code (typically RoHS compliant) | --- ### 4. Typical Applications This part is commonly used in high-density electronic environments such as: 1. **Telecommunications:** High-speed routers and switches. 2. **Computing:** Cooling of secondary processors or VRMs. 3. **Industrial:** Power supplies and motor controllers where vertical space allows for a 25mm height.