The **ATS-18F-85-C3-R0** is a specific high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "maxiFLOW™" series, designed for cooling electronic components such as CPUs, GPUs, and other integrated circuits. --- ## 1. Technical Specifications The following table summarizes the core electronic and physical attributes of the part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-18F-85-C3-R0 | | **Material** | Aluminum (Anodized Blue) | | **Thermal Resistance** | 2.50°C/W @ 200 LFM | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W x H)** | 36.83mm x 36.83mm x 10mm | | **Thermal Interface Material** | T412 (Pre-applied) | --- ## 2. Key Component Features ### A. maxiFLOW™ Design The heat sink features a tapered fin design. In electronics, this maximizes the surface area for heat dissipation while maintaining a low pressure drop. This is critical for systems with high-density component layouts where airflow may be restricted. ### B. pushPIN™ Attachment Instead of using messy adhesives or permanent solder, this part uses the **pushPIN™** system. * **Spring Mechanism:** Provides a consistent pressure (load) on the electronic chip, ensuring optimal contact with the Thermal Interface Material (TIM). * **Hardware:** Includes a brass-tipped stainless steel spring for durability. ### C. Thermal Interface Material (T412) The "C3" in the part number indicates the specific thermal pad or grease used. The **T412** is a high-efficiency interface material that fills microscopic air gaps between the component and the heat sink to lower thermal impedance. --- ## 3. Electronic Application & Compatibility This part is typically used for cooling the following types of electronic packages: 1. **BGA (Ball Grid Array):** Common in networking processors. 2. **LGA (Land Grid Array):** Common in high-end microcontrollers. 3. **ASICs:** Application-specific integrated circuits that generate significant heat during operation. ### Performance Graph Data (Typical) * **Flow Rate (LFM):** 200 | **Thermal Resistance:** 2.50 °C/W * **Flow Rate (LFM):** 400 | **Thermal Resistance:** 1.80 °C/W * **Flow Rate (LFM):** 600 | **Thermal Resistance:** 1.50 °C/W --- ## 4. Part Number Breakdown The nomenclature follows this logic: * **ATS:** Manufacturer prefix. * **18F:** Series/Family. * **85:** Specific fin geometry and dimension code. * **C3:** Thermal Interface Material type (T412). * **R0:** Revision or RoHS compliance status.