ATS-18F-87-C3-R0
AI

The **ATS-18F-87-C3-R0** is a high-performance electronic thermal management component, specifically a **Pin Fin Heat Sink** manufactured by Advanced Thermal Solutions (ATS).
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## 1. Technical Specifications
The part number follows a specific nomenclature used by ATS to describe its physical and thermal characteristics.
| Parameter | Specification |
| :--- | :--- |
| **Component Type** | Heat Sink |
| **Attachment Method** | pushPIN™ |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Thermal Resistance (Flowing)** | 2.77 °C/W @ 100 LFM |
| **Thermal Resistance (Static)** | 13.30 °C/W |
| **Dimensions (L x W x H)** | 35mm x 35mm x 20mm |
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## 2. Key Features
### Thermal Efficiency
The "Pin Fin" design is engineered to increase surface area while allowing for multi-directional airflow. This makes it ideal for environments where the direction of the cooling fan may not be fixed or where turbulence is high.
### Attachment System: pushPIN™
This part uses the proprietary **pushPIN™** system, which includes:
* **Integrated Springs:** Provides precise pressure (Force) to ensure optimal contact with the electronic component (CPU, GPU, or MOSFET).
* **Flexible Mounting:** Designed to fit pre-drilled holes on a PCB (Printed Circuit Board).
### Material & Coating
* **Aluminum 6063:** Provides a high strength-to-weight ratio and excellent thermal conductivity.
* **Blue Anodized Finish:** Not only provides aesthetic value but also increases corrosion resistance and electrical insulation on the surface.
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## 3. Applications
This part is typically found in the following electronic sectors:
1. **Telecommunications:** Cooling for high-speed routers and switches.
2. **Embedded Systems:** Industrial PCs and automation controllers.
3. **Power Electronics:** Managing heat for power converters and high-capacity transistors.
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- ⤷
What is the hole pattern requirement for the pushPIN attachment on this heat sink?
- ⤷ How does the thermal resistance change at higher airflow speeds like 500 LFM?
- ⤷ Are there alternative interface materials (TIMs) recommended for this specific model?