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  • ATS-18F-87-C3-R0

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    The **ATS-18F-87-C3-R0** is a high-performance electronic thermal management component, specifically a **Pin Fin Heat Sink** manufactured by Advanced Thermal Solutions (ATS). --- ## 1. Technical Specifications The part number follows a specific nomenclature used by ATS to describe its physical and thermal characteristics. | Parameter | Specification | | :--- | :--- | | **Component Type** | Heat Sink | | **Attachment Method** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance (Flowing)** | 2.77 °C/W @ 100 LFM | | **Thermal Resistance (Static)** | 13.30 °C/W | | **Dimensions (L x W x H)** | 35mm x 35mm x 20mm | --- ## 2. Key Features ### Thermal Efficiency The "Pin Fin" design is engineered to increase surface area while allowing for multi-directional airflow. This makes it ideal for environments where the direction of the cooling fan may not be fixed or where turbulence is high. ### Attachment System: pushPIN™ This part uses the proprietary **pushPIN™** system, which includes: * **Integrated Springs:** Provides precise pressure (Force) to ensure optimal contact with the electronic component (CPU, GPU, or MOSFET). * **Flexible Mounting:** Designed to fit pre-drilled holes on a PCB (Printed Circuit Board). ### Material & Coating * **Aluminum 6063:** Provides a high strength-to-weight ratio and excellent thermal conductivity. * **Blue Anodized Finish:** Not only provides aesthetic value but also increases corrosion resistance and electrical insulation on the surface. --- ## 3. Applications This part is typically found in the following electronic sectors: 1. **Telecommunications:** Cooling for high-speed routers and switches. 2. **Embedded Systems:** Industrial PCs and automation controllers. 3. **Power Electronics:** Managing heat for power converters and high-capacity transistors. ---
    ✨ Follow-up Questions
    • ⤷ What is the hole pattern requirement for the pushPIN attachment on this heat sink?
    • ⤷ How does the thermal resistance change at higher airflow speeds like 500 LFM?
    • ⤷ Are there alternative interface materials (TIMs) recommended for this specific model?