## Technical Overview: ATS-18F-88-C2-R0 The **ATS-18F-88-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is specifically designed as a thermal management solution for electronic components that generate significant heat, such as CPUs, GPUs, or high-power transistors. --- ### 1. Key Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Attachment Type** | Push Pin | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 35.00mm x 35.00mm x 25.00mm | | **Thermal Resistance** | 6.67°C/W (at 100 LFM) | | **Fin Pattern** | Fine Pitch (straight fins) | --- ### 2. Design and Component Breakdown #### A. The pushPIN™ Attachment System The part uses a specialized **pushPIN™** mechanism. This is a spring-loaded attachment that ensures consistent pressure (clamping force) across the component surface, which optimizes the thermal interface material (TIM) performance. #### B. Material and Coating * **Aluminum Body:** Provides a balance between high thermal conductivity and low weight. * **Blue Anodized Finish:** Not only provides corrosion resistance but also slightly increases surface emissivity for better radiant heat transfer. #### C. Thermal Performance The efficiency of this part is measured by its thermal resistance ($^\circ\text{C/W}$). The lower the number, the better the heat dissipation. * **100 LFM (Linear Feet per Minute):** 6.67 $^\circ\text{C/W}$ * **400 LFM:** 2.22 $^\circ\text{C/W}$ * **700 LFM:** 1.59 $^\circ\text{C/W}$ --- ### 3. Part Number Decoding (Nomenclature) The part number can be broken down to understand its configuration: | Segment | Meaning | | :--- | :--- | | **ATS** | Advanced Thermal Solutions (Brand) | | **18** | Series number | | **F** | Fin pitch style (Fine) | | **88** | Specific dimension/fin layout identifier | | **C2** | Thermal Interface Material (includes T766 phase-change material) | | **R0** | RoHS Compliant / Revision code | --- ### 4. Application Usage This heat sink is typically used in: 1. **Telecommunications:** High-speed routers and switches. 2. **Industrial Controls:** Power modules and motor drives. 3. **Embedded Computing:** Small form-factor motherboards where vertical space allows for a 25mm height.