The **ATS-18G-06-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to their high-performance "maxiFLOW™" product line. --- ## Technical Specifications | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-18G-06-C2-R0 | | **Type** | Heat Sink (Passive Cooling) | | **Attachment Method** | Push-Pin | | **Thermal Resistance** | 2.15 °C/W @ 200 LFM | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions** | 45mm x 45mm x 25mm | --- ## Key Features & Components ### 1. maxiFLOW™ Design The heat sink features a tapered fin design. This geometry is engineered to maximize surface area while minimizing pressure drop. It excels in environments where there is constrained airflow, as the design pulls more air through the fins compared to standard extruded heat sinks. ### 2. Attachment Mechanism (Push-Pin) The "R0" suffix indicates the use of a **Push-Pin** attachment. * **Material:** The pins are typically brass or plastic with a stainless steel spring. * **Function:** The spring provides a specific, consistent pressure (clamping force) on the electronic component (CPU, GPU, or FPGA), ensuring optimal contact with the Thermal Interface Material (TIM). ### 3. Thermal Interface Material (TIM) Usually, these parts come with **Phase Change Material (PCM)** or high-performance thermal tape pre-applied to the base. This fills microscopic air gaps between the heat sink and the chip to improve heat transfer. ### 4. Material and Coating * **Aluminum 6063:** Provides a balance of high thermal conductivity and low weight. * **Blue Anodizing:** This is not just for aesthetics; the anodized layer provides corrosion resistance and slightly improves "emissivity," helping the part radiate heat more effectively. --- ## Typical Applications This specific heat sink is designed for high-heat-density electronic components such as: * **Network Switches/Routers** (ASIC chips) * **Embedded Computing** (Single board computers) * **Power Supplies** (MOSFETs and IGBTs) * **Telecommunications Infrastructure**