ATS-18G-142-C2-R0
AI

The **ATS-18G-142-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the **push-pin** attachment series designed for cooling electronic components such as BGA (Ball Grid Array) chips, CPUs, and GPUs.
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## 1. Technical Specifications
The following table summarizes the primary physical and thermal characteristics:
| Property | Value / Description |
| :--- | :--- |
| **Material** | Aluminum (AL6063) |
| **Finish** | Blue Anodized |
| **Attachment Method** | Push-Pin (Brass) |
| **Spring Type** | Compression Spring |
| **Fin Style** | Straight Fin |
| **Thermal Resistance** | ~11.84 °C/W (at 200 LFM) |
| **Dimensions (L x W x H)** | 30.0mm x 30.0mm x 15.0mm |
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## 2. Key Electronic Components & Features
### A. Fin Geometry (Straight Fin)
The "Straight Fin" design is optimized for **forced convection** environments. Because the fins are parallel and continuous, they offer low pressure drop, making them ideal for systems with directed airflow from fans.
### B. Thermal Interface Material (TIM)
The model number includes a pre-applied **Phase Change Material (PCM)** or a thermal pad (typically indicated by the suffix). This ensures that the microscopic gaps between the electronic component (heat source) and the aluminum base are filled, maximizing heat transfer efficiency.
### C. Mechanical Attachment (Push-Pins)
Unlike adhesive-based heat sinks, the ATS-18G-142-C2-R0 uses a mechanical **Push-Pin** system:
* **Uniform Pressure:** The brass pins and springs provide consistent downward force, ensuring the TIM performs optimally.
* **Reliability:** Mechanical pins prevent the heat sink from shifting or falling off due to vibration or high-temperature cycles, which is critical for industrial electronics.
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## 3. Thermal Performance Profile
Thermal resistance varies based on the airflow (Measured in Linear Feet per Minute - LFM):
| Airflow (LFM) | Thermal Resistance (°C/W) |
| :--- | :--- |
| 200 (1.0 m/s) | 11.84 |
| 300 (1.5 m/s) | 6.75 |
| 400 (2.0 m/s) | 5.30 |
| 500 (2.5 m/s) | 4.52 |
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## 4. Typical Applications
This specific part is widely used in:
* **Telecommunications:** Network switches and routers.
* **Embedded Systems:** Industrial PC boards (PCBs).
* **Power Electronics:** Voltage regulator modules (VRMs).
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What is the hole pattern requirement for installing the push-pins for this heat sink?
- ⤷ How does the blue anodized finish impact the thermal performance?
- ⤷ Can this heat sink be customized with different spring tensions?