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  • ATS-18G-142-C2-R0

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    The **ATS-18G-142-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the **push-pin** attachment series designed for cooling electronic components such as BGA (Ball Grid Array) chips, CPUs, and GPUs. --- ## 1. Technical Specifications The following table summarizes the primary physical and thermal characteristics: | Property | Value / Description | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Brass) | | **Spring Type** | Compression Spring | | **Fin Style** | Straight Fin | | **Thermal Resistance** | ~11.84 °C/W (at 200 LFM) | | **Dimensions (L x W x H)** | 30.0mm x 30.0mm x 15.0mm | --- ## 2. Key Electronic Components & Features ### A. Fin Geometry (Straight Fin) The "Straight Fin" design is optimized for **forced convection** environments. Because the fins are parallel and continuous, they offer low pressure drop, making them ideal for systems with directed airflow from fans. ### B. Thermal Interface Material (TIM) The model number includes a pre-applied **Phase Change Material (PCM)** or a thermal pad (typically indicated by the suffix). This ensures that the microscopic gaps between the electronic component (heat source) and the aluminum base are filled, maximizing heat transfer efficiency. ### C. Mechanical Attachment (Push-Pins) Unlike adhesive-based heat sinks, the ATS-18G-142-C2-R0 uses a mechanical **Push-Pin** system: * **Uniform Pressure:** The brass pins and springs provide consistent downward force, ensuring the TIM performs optimally. * **Reliability:** Mechanical pins prevent the heat sink from shifting or falling off due to vibration or high-temperature cycles, which is critical for industrial electronics. --- ## 3. Thermal Performance Profile Thermal resistance varies based on the airflow (Measured in Linear Feet per Minute - LFM): | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 (1.0 m/s) | 11.84 | | 300 (1.5 m/s) | 6.75 | | 400 (2.0 m/s) | 5.30 | | 500 (2.5 m/s) | 4.52 | --- ## 4. Typical Applications This specific part is widely used in: * **Telecommunications:** Network switches and routers. * **Embedded Systems:** Industrial PC boards (PCBs). * **Power Electronics:** Voltage regulator modules (VRMs).
    ✨ Follow-up Questions
    • ⤷ What is the hole pattern requirement for installing the push-pins for this heat sink?
    • ⤷ How does the blue anodized finish impact the thermal performance?
    • ⤷ Can this heat sink be customized with different spring tensions?