The **ATS-18G-182-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) push-pin heat sink**. These parts are designed to dissipate heat from integrated circuits (ICs) such as CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications Below is a breakdown of the core technical parameters for this specific part number: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Heat Sink Type** | Push-pin (Spring Loaded) | | **Material** | Aluminum (Blue Anodized) | | **Fin Style** | Straight | | **Dimensions (L x W x H)** | 40mm x 40mm x 15mm | | **Thermal Resistance** | 7.51°C/W (at 200 LFM) | | **Attachment Method** | Push-Pin (Brass) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Breakdown of the Part Number The part number follows a specific nomenclature used by ATS to identify the characteristics of the heat sink: 1. **ATS-18**: Refers to the specific product series/design. 2. **G**: Refers to the physical footprint and hole pattern. 3. **182**: A internal code relating to the specific fin geometry and height. 4. **C2**: Denotes the material and finish (typically Blue Anodized Aluminum). 5. **R0**: Indicates the revision number or packaging type. --- ### 3. Key Features * **Push-Pin Attachment:** Uses a flexible, spring-loaded push-pin mechanism. This provides consistent pressure for better heat transfer and allows for quick installation on PCBs with pre-drilled holes. * **High Performance:** The straight fin design is optimized for "open-air" environments where there is a steady flow of air (forced convection). * **Pre-Applied TIM:** It comes with **T766** thermal interface material already applied to the base, which eliminates the need for manual thermal paste application and ensures a low-resistance path between the chip and the aluminum. * **Durability:** The blue anodized finish provides corrosion resistance and increased surface area at a microscopic level. --- ### 4. Application Use Cases This specific heat sink is commonly found in: * **Telecommunications:** Cooling of networking switches and routers. * **Embedded Systems:** Industrial PCs and automation controllers. * **Consumer Electronics:** High-speed modems or set-top boxes.