ATS-18G-35-C2-R0
AI

The **ATS-18G-35-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, designed to maximize heat dissipation in high-density electronic environments.
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### 1. Technical Specifications
The following table outlines the physical and thermal properties of this specific part number:
| Parameter | Specification |
| :--- | :--- |
| **Material** | Aluminum (Blue Anodized) |
| **Dimensions** | 35mm x 35mm (Footprint) |
| **Height** | 9.5mm |
| **Thermal Resistance** | 5.00° C/W (@ 100 LFM) |
| **Attachment Method** | pushPIN™ (Spring-loaded) |
| **Pressure Class** | High Pressure / Low Airflow |
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### 2. Design Characteristics
The part is engineered with specific electronic and mechanical goals:
* **maxiFLOW™ Geometry:** Features a "tapered" fin design. This increases the surface area for heat exchange while reducing air pressure drop across the component.
* **pushPIN™ Attachment:** Instead of using adhesive tape (which can fail over time), this part uses a mechanical spring-loaded pin system. This ensures consistent pressure between the heat sink and the chip (CPU/FPGA/ASIC) for optimal thermal transfer.
* **Blue Anodized Finish:** This is not just for aesthetics; the anodization protects the aluminum from corrosion and slightly improves thermal emissivity.
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### 3. Application in Electronics
This component is typically found in the following electronic systems:
1. **Networking Hardware:** Switches and routers where high-speed processors generate significant heat.
2. **Industrial PCs:** Compact systems requiring passive or active cooling in cramped enclosures.
3. **Power Supplies:** Cooling MOSFETs or power conversion ICs.
4. **Telecom:** Base station equipment where reliability and long-term mechanical attachment are critical.
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### 4. Part Number Breakdown (Nomenclature)
Understanding the code helps in identifying variations:
* **ATS:** Manufacturer (Advanced Thermal Solutions).
* **18G:** Series designation (maxiFLOW™).
* **35:** Size (35mm square).
* **C2:** Thermal performance/Fin configuration code.
* **R0:** Material/Finish code (Blue Anodized).
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What are the advantages of pushPIN™ attachment over thermal adhesive?
- ⤷ How does the thermal resistance change at higher airflow speeds (LFM)?
- ⤷ Is this heat sink compatible with standard 35mm BGA packages?