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  • ATS-18G-35-C2-R0

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    The **ATS-18G-35-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, designed to maximize heat dissipation in high-density electronic environments. --- ### 1. Technical Specifications The following table outlines the physical and thermal properties of this specific part number: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum (Blue Anodized) | | **Dimensions** | 35mm x 35mm (Footprint) | | **Height** | 9.5mm | | **Thermal Resistance** | 5.00° C/W (@ 100 LFM) | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Pressure Class** | High Pressure / Low Airflow | --- ### 2. Design Characteristics The part is engineered with specific electronic and mechanical goals: * **maxiFLOW™ Geometry:** Features a "tapered" fin design. This increases the surface area for heat exchange while reducing air pressure drop across the component. * **pushPIN™ Attachment:** Instead of using adhesive tape (which can fail over time), this part uses a mechanical spring-loaded pin system. This ensures consistent pressure between the heat sink and the chip (CPU/FPGA/ASIC) for optimal thermal transfer. * **Blue Anodized Finish:** This is not just for aesthetics; the anodization protects the aluminum from corrosion and slightly improves thermal emissivity. --- ### 3. Application in Electronics This component is typically found in the following electronic systems: 1. **Networking Hardware:** Switches and routers where high-speed processors generate significant heat. 2. **Industrial PCs:** Compact systems requiring passive or active cooling in cramped enclosures. 3. **Power Supplies:** Cooling MOSFETs or power conversion ICs. 4. **Telecom:** Base station equipment where reliability and long-term mechanical attachment are critical. --- ### 4. Part Number Breakdown (Nomenclature) Understanding the code helps in identifying variations: * **ATS:** Manufacturer (Advanced Thermal Solutions). * **18G:** Series designation (maxiFLOW™). * **35:** Size (35mm square). * **C2:** Thermal performance/Fin configuration code. * **R0:** Material/Finish code (Blue Anodized).
    ✨ Follow-up Questions
    • ⤷ What are the advantages of pushPIN™ attachment over thermal adhesive?
    • ⤷ How does the thermal resistance change at higher airflow speeds (LFM)?
    • ⤷ Is this heat sink compatible with standard 35mm BGA packages?