The **ATS-18G-41-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push pin" series designed for cooling integrated circuits (ICs) and other electronic components. --- ### 1. Key Technical Specifications | Parameter | Specification | |:---|:---| | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Fin Type** | Fine Pitch (straight fins) | | **Thermal Resistance** | 10.02°C/W (at 100 LFM) | | **Attachment Method** | Push Pin (Spring-loaded) | --- ### 2. Physical Dimensions Precision sizing is critical for ensuring the heat sink fits within the footprint of the PCB without interfering with neighboring components. * **Length:** 40.00 mm * **Width:** 40.00 mm * **Height:** 20.00 mm (Distance from the base to the top of the fins) * **Pitch/Spacing:** Designed for 45.00 mm hole spacing on the PCB. --- ### 3. Electronic Design Features #### A. Thermal Interface Material (TIM) The part comes pre-applied with **ATS-PPS-07**, a high-performance thermal interface material. This ensures maximum heat transfer between the electronic component (CPU, FPGA, or GPU) and the aluminum base by filling microscopic air gaps. #### B. Attachment Mechanism Instead of messy adhesives or simple clips, this model uses a **push pin and brass spring** system: * **Reliability:** Provides consistent pressure across the component surface. * **Ease of Assembly:** Features pre-drilled holes for rapid installation on a PCB. * **Security:** Prevents the heat sink from shifting during mechanical shock or vibration. #### C. Airflow Optimization The "Fine Pitch" fin design is optimized for systems with forced air cooling (fans). The 20mm height offers a balance between surface area for heat dissipation and low profile for compact electronic enclosures. --- ### 4. Typical Applications This part is commonly used in the following electronic environments: 1. **Telecommunications:** Cooling line cards and routers. 2. **Embedded Systems:** Industrial PCs and automation controllers. 3. **Power Supplies:** Managing heat in high-efficiency power converters. 4. **Computing:** Cooling chipsets on motherboards or high-speed networking chips.