ATS-18G-75-C3-R0
AI

The **ATS-18G-75-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors.
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### ## Technical Specifications
The model number provides specific details about its physical and thermal characteristics:
| Property | Specification | Details |
| :--- | :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) | Part of the "pushPIN™" Series |
| **Material** | Aluminum | Blue Anodized finish for durability |
| **Dimensions** | 40mm x 40mm x 10mm | Square base with low-profile height |
| **Fin Type** | Fine-Pitch / Straight Fin | Maximizes surface area for airflow |
| **Attachment** | pushPIN™ | Spring-loaded plastic or brass pins |
| **Thermal Resistance** | ~15.00 °C/W (Unducted) | Varies based on airflow (LFM) |
| **Thermal Interface** | T766 | Pre-applied phase change material |
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### ### Key Features
1. **PushPIN™ Attachment System:**
The "R0" at the end of the part number signifies a specific attachment kit. This system allows for secure mounting to a PCB using pre-drilled holes, ensuring consistent pressure for optimal heat transfer.
2. **Fine-Pitch Fin Design:**
The fins are designed to be thin and closely spaced. This is ideal for systems with high-velocity airflow (ducted systems) where surface area is critical for cooling.
3. **Blue Anodized Finish:**
Beyond aesthetics, the anodization protects the aluminum from oxidation and slightly improves radiative heat transfer.
4. **Pre-applied TIM (Thermal Interface Material):**
It comes with a high-performance thermal pad (T766) already attached to the base, reducing assembly time and ensuring a reliable thermal bond between the chip and the sink.
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### ### Performance under Airflow
Thermal resistance decreases as the velocity of air (measured in Linear Feet per Minute - LFM) increases:
| Air Velocity (LFM) | Thermal Resistance (°C/W) |
| :--- | :--- |
| 100 (0.5 m/s) | 15.02 |
| 200 (1.0 m/s) | 5.75 |
| 400 (2.0 m/s) | 3.62 |
| 600 (3.0 m/s) | 2.81 |
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- ⤷
What is the hole pattern required on the PCB for the pushPIN attachment?
- ⤷ How does the T766 thermal interface material compare to standard thermal grease?
- ⤷ Can this heat sink be used for passive cooling without a fan?