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  • ATS-18G-75-C3-R0

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    The **ATS-18G-75-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors. --- ### ## Technical Specifications The model number provides specific details about its physical and thermal characteristics: | Property | Specification | Details | | :--- | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | Part of the "pushPIN™" Series | | **Material** | Aluminum | Blue Anodized finish for durability | | **Dimensions** | 40mm x 40mm x 10mm | Square base with low-profile height | | **Fin Type** | Fine-Pitch / Straight Fin | Maximizes surface area for airflow | | **Attachment** | pushPIN™ | Spring-loaded plastic or brass pins | | **Thermal Resistance** | ~15.00 °C/W (Unducted) | Varies based on airflow (LFM) | | **Thermal Interface** | T766 | Pre-applied phase change material | --- ### ### Key Features 1. **PushPIN™ Attachment System:** The "R0" at the end of the part number signifies a specific attachment kit. This system allows for secure mounting to a PCB using pre-drilled holes, ensuring consistent pressure for optimal heat transfer. 2. **Fine-Pitch Fin Design:** The fins are designed to be thin and closely spaced. This is ideal for systems with high-velocity airflow (ducted systems) where surface area is critical for cooling. 3. **Blue Anodized Finish:** Beyond aesthetics, the anodization protects the aluminum from oxidation and slightly improves radiative heat transfer. 4. **Pre-applied TIM (Thermal Interface Material):** It comes with a high-performance thermal pad (T766) already attached to the base, reducing assembly time and ensuring a reliable thermal bond between the chip and the sink. --- ### ### Performance under Airflow Thermal resistance decreases as the velocity of air (measured in Linear Feet per Minute - LFM) increases: | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 15.02 | | 200 (1.0 m/s) | 5.75 | | 400 (2.0 m/s) | 3.62 | | 600 (3.0 m/s) | 2.81 | ---
    ✨ Follow-up Questions
    • ⤷ What is the hole pattern required on the PCB for the pushPIN attachment?
    • ⤷ How does the T766 thermal interface material compare to standard thermal grease?
    • ⤷ Can this heat sink be used for passive cooling without a fan?