The **ATS-18G-77-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) push-pin heat sink**. It is designed to cool electronic components like CPUs, GPUs, or FPGAs in high-airflow environments. --- ### Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Part Number** | ATS-18G-77-C2-R0 | | **Heat Sink Type** | Push-Pin (Spring Loaded) | | **Fin Type** | Fine Pitch (Cross-Cut) | | **Material** | Aluminum (Blue Anodized) | | **Dimensions** | 25mm x 25mm x 20mm | | **Thermal Resistance** | 9.30°C/W @ 100 LFM | | **Attachment Method** | Plastic Push-Pin with Brass Springs | | **Interface Material** | T766 (Phase Change Material) | --- ### Core Electronic Characteristics #### 1. Heat Dissipation Performance This part is engineered to manage the junction temperature ($T_j$) of semiconductor devices. The **Fine Pitch** design increases the surface area available for convection. * **Low Airflow (100 LFM):** 9.30 °C/W * **High Airflow (700 LFM):** 3.69 °C/W #### 2. Attachment Mechanism The **Push-Pin** system ensures constant pressure between the heat sink and the electronic chip. This is critical for: * Minimizing the **Thermal Interface Resistance**. * Providing mechanical stability during shock and vibration. * Ensuring a uniform bond line thickness of the thermal paste. #### 3. Pre-Applied Thermal Interface (TIM) The part comes with **T766 thermal grease** pre-applied to the base. In electronics, the TIM is essential to fill microscopic air gaps between the component and the heat sink, as air is a poor conductor of heat. #### 4. Material and Finish * **Aluminum 6063:** Chosen for high thermal conductivity and low weight. * **Blue Anodizing:** Besides aesthetics, the anodized layer provides a small amount of electrical insulation and increased emissivity for radiation cooling. --- ### Typical Applications * **Network Switches/Routers:** Cooling high-speed processing chips. * **Embedded Systems:** For industrial PCs where space is limited. * **Power Supplies:** Cooling MOSFETs or voltage regulators.