The **ATS-18G-79-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push pin" series designed for cooling processors and other surface-mount electronic components. --- ### Technical Specifications | Parameter | Specification | | :--- | :--- | | **Part Number** | ATS-18G-79-C2-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push Pin (Plastic/Brass) | | **Thermal Resistance** | 2.63°C/W @ 100 LFM | | **Dimensions** | 25mm x 25mm | | **Height** | 30.00 mm | | **Fin Style** | Straight Fin | --- ### Key Design Features #### 1. Material and Coating The unit is constructed from high-quality **Aluminum**. The **Blue Anodized** finish is not just for aesthetics; it provides surface protection against corrosion and slightly improves radiant heat emission. #### 2. Attachment Mechanism: Push Pins This model utilizes a **Push Pin** system with a compression spring. * **Ease of Assembly:** Allows for quick installation on the PCB. * **Constant Pressure:** The springs ensure uniform pressure is applied to the thermal interface material (TIM), optimizing heat transfer between the chip and the heat sink. * **Pre-Drilled Holes:** Requires specific hole locations on the PCB for mounting. #### 3. Fin Geometry It uses a **Straight Fin** design. This is ideal for "unidirectional" airflow (where air is blown from one specific direction across the fins). This design offers low pressure drop and efficient cooling in forced-air environments. #### 4. Thermal Interface Material (TIM) The "R0" suffix typically indicates that the part comes with **no pre-applied thermal tape**, or it may include a specific high-performance phase-change material depending on the exact lot configuration. Usually, users apply their own thermal grease or pad for this specific series. --- ### Applications * **Networking Equipment:** High-speed routers and switches. * **Embedded Systems:** Industrial PCs and controllers. * **Power Supplies:** Cooling MOSFETs or voltage regulators. * **CPUs/GPUs:** Smaller-scale processing units that require active or passive cooling within a chassis.