## Electronic Specifications: ATS-18G-80-C2-R0 The **ATS-18G-80-C2-R0** is a high-performance **heat sink** assembly manufactured by Advanced Thermal Solutions (ATS). While it is a mechanical component, its specifications are critical for the thermal management of electronic parts like CPUs, GPUs, and FPGAs. --- ### 1. Key Technical Specifications The part number follows a specific nomenclature used by ATS to define the dimensions and material properties. | Specification | Details | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Dimensions (L x W x H)** | 54.00mm x 54.00mm x 25.00mm | | **Thermal Resistance** | Variable (Based on Airflow) | | **Compliance** | RoHS & REACH Compliant | --- ### 2. Electronic Thermal Performance In electronics, the efficiency of a heat sink is measured by its **Thermal Resistance ($\theta$)**, expressed in Celsius per Watt (°C/W). Lower values indicate better cooling performance. | Airflow Velocity (LFM) | Thermal Resistance (Unducted) | Thermal Resistance (Ducted) | | :--- | :--- | :--- | | 100 (0.5 m/s) | 1.90 °C/W | 1.06 °C/W | | 200 (1.0 m/s) | 1.07 °C/W | 0.85 °C/W | | 400 (2.0 m/s) | 0.77 °C/W | 0.72 °C/W | --- ### 3. Structural & Component Parts This assembly consists of three primary electronic-grade sub-components: 1. **Heat Sink Body:** A cross-cut fin design that allows for multi-directional airflow, making it ideal for high-density PCB layouts where airflow direction may vary. 2. **pushPIN™ Attachment:** Uses a brass pin and a stainless steel spring. This provides a precise "compression force" (calculated to prevent cracking the silicon die) while ensuring a secure fit to the PCB. 3. **Thermal Interface Material (TIM):** This specific model typically comes with **T412** pre-applied. * **T412** is a high-efficiency thermal tape or pad designed to fill microscopic air gaps between the electronic chip and the aluminum base. --- ### 4. Application in Electronics This part is commonly used for cooling the following electronic components: * **Large FPGAs/ASICs:** Found in networking gear. * **Processors:** Low to mid-range power processors in industrial computing. * **Power Modules:** High-density DC-DC converters. ---