## Technical Overview: ATS-18G-82-C2-R0 The **ATS-18G-82-C2-R0** is a high-performance **heat sink** assembly manufactured by Advanced Thermal Solutions (ATS). While it is a mechanical component, it is integral to electronic systems for thermal management, specifically designed for cooling BGA (Ball Grid Array) components. --- ### 1. Key Technical Specifications | Parameter | Specification | Details | | :--- | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | Part of the "pushPIN™" Series | | **Material** | Aluminum | Lightweight with high thermal conductivity | | **Finish** | Blue Anodized | Protects against corrosion and enhances emissivity | | **Attachment Type** | pushPIN™ | Uses a spring-loaded pin mechanism | | **Thermal Resistance** | 2.47 °C/W (at 100 LFM) | Rate of heat transfer efficiency | | **Dimensions** | 30.00mm x 30.00mm | Surface area footprint | | **Height** | 15.00mm | Vertical clearance requirement | --- ### 2. Functional Electronic Components The assembly consists of three primary elements that work together to manage the heat generated by semiconductors: 1. **Heat Sink Body (Fins):** * Features a **fine-pitch design** to maximize surface area. * Designed for "straight-fin" airflow, meaning it works best when air is forced through the channels by a system fan. 2. **Attachment Mechanism (pushPIN™):** * Consists of brass or plastic pins and a stainless steel spring. * Provides a precise **compression force** to ensure optimal contact between the heat sink and the electronic chip (IC). 3. **Thermal Interface Material (TIM):** * Usually comes pre-applied with **T766** (or similar) thermal phase-change material or tape. * This fills microscopic air gaps between the chip die and the aluminum base to lower thermal impedance. --- ### 3. Application Use Cases This specific part is typically found in the following electronic environments: * **Networking Hardware:** Routers, switches, and gateways. * **Embedded Systems:** Industrial PCs and controllers. * **Power Supplies:** Cooling MOSFETs or voltage regulators. * **Telecommunications:** Base stations and signal processing units. --- ### 4. Thermal Performance Data *Measured in °C/W (Lower is better)* | Airflow Velocity (LFM) | 100 | 200 | 300 | 400 | 500 | | :--- | :--- | :--- | :--- | :--- | :--- | | **Unducted Flow** | 2.47 | 1.47 | 1.21 | 1.06 | 0.96 | | **Ducted Flow** | 1.57 | 1.00 | 0.85 | 0.76 | 0.70 |