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  • ATS-18G-84-C2-R0

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    The **ATS-18G-84-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, designed for cooling high-power semiconductors. --- ### 1. Technical Specifications Below are the primary mechanical and thermal specifications for this part: | Parameter | Specification | | :--- | :--- | | **Material** | Blue Anodized Aluminum | | **Dimensions (L x W x H)** | 54.00mm x 54.00mm x 25.00mm | | **Thermal Resistance** | 1.15°C/W (at 200 LFM) | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Fin Style** | Straight Fin / maxiFLOW™ | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Design Characteristics This part is engineered for high-efficiency heat dissipation in constrained spaces: * **maxiFLOW™ Geometry:** The fin profile is designed to maximize surface area while creating a lower pressure drop, allowing air to flow through the sink more efficiently. * **pushPIN™ Attachment:** It uses a spring-loaded mechanism that ensures even pressure across the electronic component (like a CPU or GPU). This prevents the heat sink from tilting and ensures optimal contact with the Thermal Interface Material (TIM). * **T766 Thermal Interface:** The part comes with a pre-applied phase-change material that fills microscopic air gaps between the component and the heat sink, significantly reducing thermal resistance. --- ### 3. Application Use Cases This specific heat sink is typically used in industrial and high-speed electronic environments: * **Networking Hardware:** Switches, routers, and high-capacity modems. * **Power Supplies:** Cooling MOSFETs or IGBTs in high-density power modules. * **Embedded Computing:** Cooling high-performance FPGAs or ASICs where airflow is directed through a chassis. --- ### 4. Thermal Performance Data Performance varies based on airflow (measured in Linear Feet per Minute - LFM): | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **1.0 m/s (200 LFM)** | 1.15 | | **2.0 m/s (400 LFM)** | 0.85 | | **3.0 m/s (600 LFM)** | 0.70 |
    ✨ Follow-up Questions
    • ⤷ What are the different types of pushPIN attachment options for this model?
    • ⤷ How does the T766 TIM compare to standard thermal grease?
    • ⤷ Can this heat sink be used with a custom fan shroud?