The **ATS-18G-85-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **maxiFLOW™** series, designed to provide high-efficiency cooling for electronic components like processors, FPGAs, and ASICs. --- ## 1. Technical Specifications The following table outlines the physical and thermal properties of this specific part number: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Blue Anodized) | | **Dimensions** | 40.00mm x 40.00mm | | **Height** | 9.50mm | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 3.56°C/W (at 200 LFM) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ## 2. Key Design Elements ### A. maxiFLOW™ Fin Geometry The "G" in the part number indicates the maxiFLOW™ design. Unlike standard straight fins, these heat sinks feature a **flared fin structure**. * **Purpose:** This increases the effective surface area and improves airflow intake. * **Result:** It significantly reduces the pressure drop, allowing for better cooling in systems with restricted airflow. ### B. pushPIN™ Attachment System The part uses a specialized mounting mechanism rather than simple adhesive: * **Precision Springs:** Provides consistent pressure to ensure optimal contact with the electronic component. * **Plastic/Brass Push Pins:** Designed to fit into pre-drilled holes on the PCB (Printed Circuit Board). * **Ease of Assembly:** Allows for secure mechanical attachment that is more reliable than thermal tape in high-vibration environments. ### C. Thermal Interface Material (TIM) The unit comes with **T766** pre-applied to the base. This is a high-performance phase-change or grease-like material that fills microscopic air gaps between the component and the heat sink to maximize heat transfer. --- ## 3. Application Use Cases This component is typically found in: 1. **Telecommunications:** High-speed routers and switches. 2. **Industrial PCs:** Compact systems requiring low-profile cooling (9.5mm height). 3. **Power Supplies:** Heat dissipation for MOSFETs and power regulators. ---