### ATS-18G-89-C2-R0: Technical Overview The **ATS-18G-89-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push pin" series designed for cooling electronic components, specifically BGAs (Ball Grid Arrays) and other surface-mount devices. --- ### 1. Key Technical Specifications | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push Pin (Brass) | | **Spring Type** | Compression Spring | | **Thermal Resistance (Flowing Air)** | 1.87 °C/W @ 200 LFM | | **Thermal Resistance (Static Air)** | 3.65 °C/W | | **Dimensions (L x W x H)** | 35.00mm x 35.00mm x 20.00mm | --- ### 2. Component Design & Parts The assembly consists of four primary functional components: 1. **Heat Sink Body:** * **Fin Style:** Features a **Straight Fin** design. This allows for high-efficiency cooling in systems where there is a consistent directional airflow. * **Material:** Made from lightweight aluminum for high thermal conductivity. 2. **Push Pins:** * Constructed from **Brass**. These are used to secure the heat sink to the PCB through pre-drilled holes. * This provides a more reliable mechanical connection than thermal tape or adhesives. 3. **Compression Springs:** * These springs sit between the pin head and the heat sink. They provide the necessary **downward pressure** to ensure a tight interface between the heat sink and the electronic chip, optimizing heat transfer. 4. **Interface Material (TIM):** * Standard models usually come with a **pre-applied Thermal Interface Material** (like T766) on the base to minimize air gaps and improve conductivity. --- ### 3. Thermal Performance Analysis The electronic cooling efficiency depends heavily on the velocity of air (measured in Linear Feet per Minute - LFM): | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **200 (1.0 m/s)** | 1.87 | | **400 (2.0 m/s)** | 1.15 | | **600 (3.0 m/s)** | 0.92 | | **800 (4.0 m/s)** | 0.82 | --- ### 4. Application and Use Cases * **Processors/FPGAs:** Ideal for cooling high-speed logic chips that generate significant heat. * **Telecommunications:** Used in rack-mounted hardware where forced-air cooling is present. * **Embedded Systems:** Suitable for industrial PCs where vibration resistance (offered by push-pins) is required.