The **ATS-18G-91-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** product line, designed to provide maximum surface area for cooling electronic components. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of the part: | Characteristic | Specification | | :--- | :--- | | **Material** | Aluminum (Blue Anodized) | | **Dimensions** | 40mm x 40mm x 10mm | | **Attachment Method** | pushPIN™ (Brass/Plastic pins) | | **Thermal Resistance** | 21.90 °C/W (Unducted Flow @ 200 LFM) | | **Thermal Interface Material** | T766 (Pre-applied) | | **Airflow Direction** | Vertical | --- ### 2. Key Components & Features #### A. The Fin Geometry (maxiFLOW™) The "maxiFLOW" design features a flared fin structure. Unlike standard straight-fin heat sinks, these fins taper outwards. This reduces pressure drop and increases the surface area exposed to the airflow, making it highly efficient in forced-air environments. #### B. pushPIN™ Attachment System The **C2** suffix in the part number indicates the attachment mechanism. This system uses: * **Compression Springs:** Provides specific pressure to ensure consistent contact between the heat sink and the component (BGA/FPGA). * **Brass/Plastic Pins:** Secure the assembly to the PCB through pre-drilled holes. #### C. Thermal Interface Material (TIM) The unit comes with **T766** pre-applied to the base. This is a phase-change or high-performance thermal grease that fills microscopic air gaps between the heat sink and the chip, significantly reducing thermal resistance. --- ### 3. Applications This part is typically used for cooling integrated circuits (ICs) that generate moderate heat in space-constrained environments: * **Telecommunications:** Network switches and routers. * **Embedded Systems:** Industrial PCs and controllers. * **Computing:** High-speed memory modules or Southbridge chipsets. --- ### 4. Part Number Breakdown * **ATS:** Advanced Thermal Solutions (Manufacturer) * **18:** Series/Internal Reference * **G:** Fin pitch/style * **91:** Specific dimension code * **C2:** Attachment kit type (pushPIN) * **R0:** Revision/RoHS Compliance status