The **ATS-18G-95-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, designed to optimize airflow and heat dissipation for electronic components like BGA (Ball Grid Array) chips. --- ### 1. Technical Specifications The following table summarizes the primary physical and thermal characteristics of this part: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum (Blue Anodized) | | **Dimensions (L x W x H)** | 40mm x 40mm x 30mm | | **Attachment Method** | pushPIN™ (Brass pins / Steel springs) | | **Thermal Resistance** | 1.70°C/W (at 200 LFM) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | | **Fin Style** | maxiFLOW (High Performance) | --- ### 2. Key Features and Components * **maxiFLOW™ Geometry:** The heat sink features a unique "flared" fin design. This geometry increases the surface area while reducing pressure drop, which allows for maximum heat extraction in restricted airflow environments. * **pushPIN™ Attachment:** This model uses a standardized mechanical attachment system. It includes brass pins and stainless steel springs to ensure a precise, firm, and repeatable connection to the PCB, providing consistent pressure on the component. * **Pre-applied TIM:** It comes with **T766 thermal interface material** already applied to the base. This eliminates the need for separate thermal paste application and ensures low thermal resistance between the chip and the aluminum base. * **Material and Finish:** The use of 6063 aluminum provides high thermal conductivity, while the **Blue Anodized** finish offers corrosion resistance and improved emissivity. --- ### 3. Application and Usage This part is typically used in hardware where heat density is high but space is limited: * **Networking Equipment:** High-speed routers, switches, and gateways. * **Computing:** CPU/GPU cooling in embedded systems or industrial PCs. * **Telecommunications:** Base stations and signal processing units. ### 4. Thermal Performance Comparison Thermal resistance ($\theta_{ja}$) varies based on airflow (measured in Linear Feet per Minute - LFM): | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 (1.0 m/s) | 1.70 | | 400 (2.0 m/s) | 1.00 | | 600 (3.0 m/s) | 0.80 |