The **ATS-18H-08-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions Inc.* It belongs to the **blueICE™** or **pushPIN™** series, designed for cooling electronic components like CPUs, GPUs, and high-power chipsets. --- ## 🛠️ Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Part Number** | ATS-18H-08-C2-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 14.61°C/W (Unducted Flow @ 100 LFM) | | **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 15.00mm | | **Fin Pattern** | Fine Pitch (Square Cross-Cut) | --- ## 🔍 Key Components & Design Features ### 1. The Heat Sink Body The part is made of **Aluminum 6063**, which offers a balance between thermal conductivity and weight. The "Square" or "Cross-Cut" fin design increases the surface area, allowing air to flow through the fins from multiple directions, which is ideal for systems with inconsistent airflow. ### 2. pushPIN™ Attachment System Instead of using messy adhesives or tapes, this model uses a mechanical **pushPIN™** system: * **Spring-loaded:** Ensures even pressure across the component for maximum thermal transfer. * **Reliability:** Provides a secure fit that resists vibration and mechanical shock better than thermal tape. ### 3. Thermal Interface Material (TIM) The "C2" in the part number indicates the type of thermal interface. This model typically comes with a **pre-applied thermal phase-change material** or a high-performance thermal pad, ensuring that there are no air gaps between the chip and the aluminum base. ### 4. Blue Anodized Finish The blue coating is not just for aesthetics; **Anodization** protects the aluminum from corrosion and slightly improves surface emissivity, aiding in heat radiation. --- ## 📉 Performance Profile (Airflow) | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 14.61 | | 300 (1.5 m/s) | 4.66 | | 500 (2.5 m/s) | 3.00 | | 700 (3.5 m/s) | 2.33 | *Note: Performance improves drastically as airflow (LFM) increases.* --- ## 💡 Applications * **BGA Cooling:** Ideal for Ball Grid Array processors. * **Power Supplies:** Cooling voltage regulators or MOSFETs. * **Telecommunications:** Used in routers and switches where high-density heat must be dissipated.